Wire to board connector 3M 3448-45108 featuring glass filled PBT insulation and UL CUL agency listings
Manufacturer:
3M
Description:
Rectangular Connector Accessories RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Accessories
Specifications
Mfr. Part #:
3448-45108
Model Number:
3448-45108
Introduction
Product Overview
The 3M Ribbon Cable Socket and Header, 451 and 452 Series, offers a reliable interconnect solution with a 1.27mm (0.050") pitch. These assemblies are designed for wire-to-board applications, featuring wiremount socket assemblies (451 Series) and shrouded boardmount header latch and eject assemblies (452 Series). They are suitable for a wide range of operating temperatures and provide robust electrical and mechanical performance for demanding environments.
Product Attributes
- Brand: 3M
- Series: 451 Series (Wiremount Socket Assembly), 452 Series (Shrouded Boardmount Header Latch and Eject)
- Pitch: 1.27mm (0.050")
- Agency Listings: Underwriters Laboratories (UL), CUL
- Socket Insulation Material: Glass filled PBT, 94V-0
- Cover Insulation Material: Glass filled PBT, 94V-0
- Strain Relief Material: Stainless Steel
- Socket Contact Material: BeCu
- Header Insulation Material: Glass filled LCP, 94V-0
- Header Pin Material: Phosphor Bronze
- Plating (Socket & Header): Nickel, Gold, Matte Sn (Soldertail)
- Origin: USA (Implied by address)
Technical Specifications
| Specification | Value | Units | Conditions / Notes |
|---|---|---|---|
| Temperature Range (EIA) | -65 to +125 | C | |
| Insulation Resistance | >1 x 109 | at 500 VDC | |
| Current Rating (4-30 poles, All contacts powered) | 0.75 | A | 30C max temperature rise (EIA-364-070 Method 2) |
| Current Rating (4-30 poles, 6 contacts powered) | 1.50 | A | 30C max temperature rise (EIA-364-070 Method 2) |
| Current Rating (32-50 poles, All contacts powered) | 0.75 | A | 30C max temperature rise (EIA-364-070 Method 2) |
| Current Rating (32-50 poles, 6 contacts powered) | 1.50 | A | 30C max temperature rise (EIA-364-070 Method 2) |
| UL Ratings (4-50 poles) | 130 C, 125 Vac/Vdc, 1.0 A | ||
| CUL Ratings (4 - 30 poles) | 130 C, 125 Vac/Vdc, 1.0 A | ||
| CUL Ratings (32- 50 poles) | 130 C, 125 Vac/Vdc, 0.75 A | ||
| Operating Voltage | 125 | Vdc/ac (peak) | |
| Dielectric Withstanding Voltage | 1250 | VDC | 1 minute duration, no disruptive discharge (EIA-364-20 Method A Test Condition I) |
| Dielectric Breakdown Voltage | 1250 | VDC | Ramp assembled pair at 500V/s (EIA-364-20 Method A Test Condition I) |
| Low Level Connection Resistance (LLCR) | <10 or <30 | mOhm | Max R contact resistance per mated interface |
| Header Pin Retention | 4.5 | Newtons (MIN) | Average/pin (EIA-364-29) |
| Vibration | 3.10 | g | Random and Swept-sine (EIA-364-28, IEC-60512-6d-2e-6c) |
| Mechanical Shock | 30 | g | Half-sine, 11ms (EIA-364-27 Test Condition H/A) |
| Durability (Full) | 100 (30" Au, 4-30p) / 25 (30" Au, 32-50p) / 20 (Flash Au) | Mating cycles | 10 milliohm max R contact resistance (EIA-364-13) |
| Mating Force / Contact | 1.25 | Newtons (MAX) | Connector average/pin (EIA-364-13 Method B) |
| Unmating Force / Contact | 0.4 | Newtons (MIN) | Connector average/pin (EIA-364-18) |
| Plating Thickness (Tin) | 5.08-10.2 (200-400) | m (") | (EIA-364-48 Method C) |
| Plating Thickness (Nickel) | 1.27-3.81 (50-150) | m (") | (EIA-364-48 Method C) |
| Plating Thickness (Gold) | 0.76 min (30) | m (") | (EIA-364-48 Method C) |
| Solderability (Header) | 95% | coverage | As-received hours (EIA-364-52) |
| Temperature Life (Full) | 1008 | hours C | 30 milliohm max R contact resistance (EIA-364-17 Method A Condition 5D) |
| Thermal Shock | -65 to +125 | C | 10 milliohm max R contact resistance (EIA-364-32, Table 2, Condition II) |
| Moisture Sensitivity Level (Header) | Level 1 | (J-STD-020E) | |
| Mixed Flowing Gas | 336 | hours | Class IIA (EIA-364-65B) |
| Humidity Temperature Cycling | 10 | Days | (EIA-364-31, Method III, Fig 1) |
2411220419_3M-3448-45108_C17423009.pdf
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