Chip Carrier Socket 3M 8420-21A1-RK-TP with High Temperature Insulator and Matte Tin Contact Plating
Product Overview
The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular configurations. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are also compatible with automated loading equipment. The open-top design facilitates unrestricted airflow, while molded slots allow for easy device extraction. Optional PCB locating posts are available. These sockets are RoHS Compliant.
Product Attributes
- Brand: 3M
- Series: 8400 Series
- Insulation Material: Glass Filled Polyphenylene Sulfide (PPS)
- Flammability: UL 94V-0
- Color: Black
- Contact Material: Copper Alloy
- Underplating: 50 " [ 1.27 m ] Nickel
- Overall Wiping Area Plating: 160 ", [ 4.06 m ] Matte Tin
- RoHS Compliance: Yes (RIA E1 and C1 apply)
- Moisture Sensitivity Level: 1 (per J-STD-020C)
Technical Specifications
| Specification | Value |
|---|---|
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
| Temperature Rating | -40C to +105C |
| Process Rating | Maximum 260C, single pass (profile per J-STD-020C) |
Ordering Information
Note: For Tape and Reel Packaging dimensions, contact 3M customer service or your preferred 3M distributor.
Alignment Feature:
- A = With Location Post (tube packaging only)
- B = Without Location Post
Packaging:
- TP = Tube Pack
- TR = Tape and Reel
| Contact Quantity | A [mm (Inch)] | B [mm (Inch)] | C [mm (Inch)] | D [mm (Inch)] | E [mm (Inch)] | F [mm (Inch)] | G [mm (Inch)] | H [mm (Inch)] |
|---|---|---|---|---|---|---|---|---|
| 20 | 15.65 [0.616] | 15.65 [0.616] | 5.08 [0.200] | 5.08 [0.200] | 10.03 [0.395] | 10.03 [0.395] | 12.70 [0.500] | 6.35 [0.250] |
| 28 | 18.18 [0.716] | 18.18 [0.716] | 7.62 [0.300] | 7.62 [0.300] | 12.57 [0.495] | 12.57 [0.495] | 15.24 [0.600] | 7.62 [0.300] |
| 32 | 18.18 [0.716] | 20.75 [0.817] | 7.62 [0.300] | 10.16 [0.400] | 12.57 [0.495] | 15.11 [0.595] | 17.78 [0.700] | 7.62 [0.300] |
| 44 | 23.28 [0.917] | 23.28 [0.917] | 12.70 [0.500] | 12.70 [0.500] | 17.65 [0.695] | 17.65 [0.695] | 20.32 [0.800] | 10.16 [0.400] |
| 52 | 25.84 [1.017] | 25.84 [1.017] | 15.24 [0.600] | 15.24 [0.600] | 20.19 [0.795] | 20.19 [0.795] | 22.86 [0.900] | 11.43 [0.450] |
| 68 | 30.95 [1.219] | 30.95 [1.219] | 20.32 [0.800] | 20.32 [0.800] | 25.27 [0.995] | 25.27 [0.995] | 27.94 [1.100] | 13.97 [0.550] |
| 84 | 36.00 [1.417] | 36.00 [1.417] | 25.40 [1.000] | 25.40 [1.000] | 30.35 [1.195] | 30.35 [1.195] | 33.02 [1.300] | 16.51 [0.650] |
Tolerance Unless Noted:
| mm | Inch | Tolerance |
|---|---|---|
| .0 | .00 | .3 |
| .000 | .00 | .20 |
Important Notice: 3M PLCC products are tin plated on the contact wiping surface. This is necessary to ensure mated reliability since standard PLCC contacts are also tin plated. Tin whiskers are an inherent characteristic of tin, and mechanically stressing the tin is a known driver of whisker growth. It is possible the PLCC and PLCC socket may exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations, which include whisker mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Customers should consider whether a PLCC socket is suitable for their particular needs after considering product application lifespan and environment, including mechanical stresses, humidity, and thermal cycling, all of which have been shown to stimulate tin whisker growth.
2410121845_3M-8420-21A1-RK-TP_C5841309.pdf
