Low Profile Four Row Through Hole Chip Carrier Socket 3M 8444-11B1-RK-TP Compatible with JEDEC MO-047 and MO-052
3M Chip Carrier Sockets - Low Profile, Four-Row, Through Hole 8400 Series
Product Overview
The 3M Chip Carrier Sockets, 8400 Series, are designed for reliable interfacing with chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These low-profile, four-row, through-hole sockets are compatible with automated loading equipment, featuring an open top design for unrestricted airflow and molded slots for easy device extraction. They are suitable for wave soldering processes. These sockets are RoHS Compliant, with specific compliance information available in the Regulatory Information Appendix (RIA) in the "RoHS Compliance" section of www.3Mconnector.com (RIA E1 and C1 apply).
Important Notice Regarding Tin Whisker Growth:
3M PLCC products are tin-plated on the contact wiping surface, a necessary feature for ensuring mated reliability as standard PLCC contacts are also tin-plated. Tin whiskers are an inherent characteristic of tin, and mechanical stressing can promote their growth. It is possible for the PLCC and PLCC socket to exhibit tin whisker growth after mating. 3M adheres to iNEMI plating recommendations, utilizing whisker-mitigating tin plating chemistry to reduce the likelihood of growth. Users should carefully consider the suitability of a PLCC socket for their specific application, taking into account the product application's lifespan and environment, including mechanical stresses, humidity, and thermal cycling, which are known to stimulate tin whisker growth.
Product Attributes
- Brand: 3M
- Series: 8400 Series
- Type: Chip Carrier Sockets
- Configuration: Low Profile, Four-Row, Through Hole
- Material (Insulation): Glass Filled Polyester (PBT)
- Material (Contact): Copper Alloy
- Color: Black
- Flammability: UL 94V-0
- Certifications: RoHS Compliant (RIA E1 and C1 apply)
- Packaging: Tubes
Technical Specifications
| Specification | Details |
|---|---|
| Chip Carrier Compatibility | JEDEC outline MO-047 (square) and MO-052 (rectangular) |
| Automation Compatibility | Compatible with automated loading equipment |
| Design Feature | Open top for unrestricted air flow; Molded slots for device extraction |
| Soldering Compatibility | Wave Solder Compatible (Not suitable for reflow soldering) |
| Contact Plating (Underplating) | 50 " [1.27 m] Nickel |
| Contact Plating (Wiping Area) | 160 " [4.06 m] Matte Tin |
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
| Temperature Rating | -40C to +105C |
| Process Rating | Wave Solder Only |
Ordering Information
| Contact Quantity | Part Number | A (mm [inch]) | B (mm [inch]) | C (mm [inch]) | D (mm [inch]) |
|---|---|---|---|---|---|
| 20 | 8420-11B1-RK-TP | 15.50 [0.611] | 15.50 [0.611] | 5.08 [0.200] | 5.08 [0.200] |
| 28 | 8428-11B1-RK-TP | 18.05 [0.711] | 18.05 [0.711] | 7.62 [0.300] | 7.62 [0.300] |
| 32 | 8432-11B1-RK-TP | 18.05 [0.711] | 20.60 [0.812] | 7.62 [0.300] | 10.16 [0.400] |
| 44 | 8444-11B1-RK-TP | 23.50 [0.926] | 23.50 [0.926] | 12.70 [0.500] | 12.70 [0.500] |
| 52 | 8452-11B1-RK-TP | 25.88 [1.020] | 25.88 [1.020] | 15.24 [0.600] | 15.24 [0.600] |
| 68 | 8468-11B1-RK-TP | 31.05 [1.223] | 31.05 [1.223] | 20.32 [0.801] | 20.32 [0.801] |
| 84 | 8484-11B1-RK-TP | 36.05 [1.420] | 36.05 [1.420] | 25.40 [1.001] | 25.40 [1.001] |
Note: Dimensions are for reference only. Tolerance Unless Noted: .3 mm for .0, .20 mm for .00.
2411220011_3M-8444-11B1-RK-TP_C5199906.pdf
