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wire to board interconnect solution featuring 3M 3448-45110 with 1.27mm pitch and durable materials

Manufacturer:
3M
Description:
Rectangular Connector Accessories RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Accessories
Specifications
Mfr. Part #:
3448-45110
Model Number:
3448-45110
Introduction

Product Overview

The 3M Ribbon Cable Socket and Header, 451 and 452 Series, offers a reliable interconnect solution with a 1.27mm (0.050") pitch. Designed for wire-to-board applications, these assemblies feature robust construction with glass-filled PBT and LCP insulation materials, and durable contact plating options including nickel and gold. They are suitable for a wide temperature range and meet stringent electrical and mechanical performance requirements, making them ideal for various industrial and electronic applications.

Product Attributes

  • Brand: 3M
  • Series: 451 Series (Wiremount Socket Assembly), 452 Series (Shrouded Boardmount Header Latch and Eject)
  • Pitch: 1.27mm (0.050")
  • Socket Insulation Material: Glass filled PBT, 94V-0
  • Cover Insulation Material: Glass filled PBT, 94V-0
  • Strain Relief Material: Stainless Steel
  • Socket Contact Material: BeCu
  • Header Insulation Material: Glass filled LCP, 94V-0
  • Header Pin Material: Phosphor Bronze
  • Agency Listings: Underwriters Laboratories (UL), CUL

Technical Specifications

Specification Value / Limit Units Requirement / Conditions Test Standard / Method
Temperature Range (EIA) -65 to +125 C
Insulation Resistance >1 x 109 at 500 VDC
Current per EIA-364-70 (4-30 poles) 0.75 (All contacts powered) / 1.50 (6 contacts powered) A 30C maximum temperature rise EIA-364-070 Method 2
Current per EIA-364-70 (32-50 poles) 0.75 (All contacts powered) / 1.50 (6 contacts powered) A 30C maximum temperature rise EIA-364-070 Method 2
UL Ratings (4-50 poles) Temp: 130C, Voltage: 125 Vac/Vdc, Current: 1.0 A UL File No. E68080
CUL Ratings (4-30 poles) Temp: 130C, Voltage: 125 Vac/Vdc, Current: 1.0 A
CUL Ratings (32-50 poles) Temp: 130C, Voltage: 125 Vac/Vdc, Current: 0.75 A
Ratings Voltage 125 Vdc/ac (peak)
Dielectric Withstanding Voltage 1250 VDC No disruptive discharge during 1 minute duration. Sea level with 70% relative humidity. Excludes cable. EIA-364-20 Method A Test Condition I
Dielectric Breakdown Voltage 1250 VDC Ramp assembled pair at 500V/s until electrical arc. Sea level with 70% relative humidity. Excludes cable. EIA-364-20 Method A Test Condition I
Low Level Connection Resistance (LLCR) <10 or <30 Milliohms Max R contact resistance per mated interface throughout testing. <30mOhm for Temperature Life. <10mOhm for all other tests. EIA-364-23
Header Pin Retention 4.5 (MIN) Newtons Average/pin EIA-364-29
Vibration 3.10 (g) gravitational force Random, 15min each x, y, z planes. No strain relief clip. No discontinuities >10ns, max R 10 milliohm. EIA-364-28 Condition VII Letter D
Vibration (Swept-sine) 2.5 hours each x, y, z planes, 10-2000 Hz Double ended socket harness with strain relief clip. No discontinuities >10ns, max R 10 milliohm. IEC-60512-6d-2e- 6c
Mechanical Shock 30 (g) gravitational force Half-sine, 11ms, 3 pulses each x, y, z. No strain relief clip. No discontinuities >10ns, max R 10 milliohm. EIA-364-27 Test Condition H
Mechanical Shock (Half-sine) 11ms, 3 pulses each x, y, z Double ended socket harness with strain relief clip. No discontinuities >10ns, max R 10 milliohm. EIA-364-27 Test Condition A
Durability (Full) 100 (30" Au, 4-30p) / 25 (30" Au, 32-50p) / 20 (Flash Au) Mating cycles 10 milliohm max R contact resistance per mated interface throughout testing. EIA-364-13
Mating Force / Contact 1.25 (MAX) Newtons Connector average/pin. Mated to a .0148" square pin connector. Without friction bumps. EIA-364-13 Method B
Durability (Preconditioning) 50 (4-30p) / 25 (32-50p) Mating cycles 10 milliohm max R contact resistance per mated interface throughout testing. (30"Au only) EIA-364-13
Unmating Force / Contact 0.4 (MIN) Newtons Connector average/pin. Mated to a .0148" square pin connector. Without friction bumps. EIA-364-18
Plating Thickness (Tin) 5.08-10.2 (200-400) Micro-meter (Micro-inch) Random measurements from any 3 lots shall not be outside of specification. EIA-364-48 Method C
Plating Thickness (Nickel) 1.27-3.81 (50-150) Micro-meter (Micro-inch) Random measurements from any 3 lots shall not be outside of specification.
Plating Thickness (Gold) 0.76 min (30) Micro-meter (Micro-inch) Minimum of random measurements from any 3 lots shall not be less than specified.
Solderability (Header) hours 95 percent coverage of solderable area. No steam age. EIA-364-52
Temperature Life (Full) 1008 / 125 hours / C No physical abnormalities. 30 milliohm max R contact resistance throughout testing. EIA-364-17 Method A Condition 5D
Thermal Shock -65 to +125 C No physical abnormalities. 10 milliohm max R contact resistance per mated interface throughout testing. EIA-364-32, Table 2, Condition II
Moisture Sensitivity Level (Header) Level 1 (85C / 85% RH, 168 hours) No defects such as deformation, blister, damage, crack, etc., must maintain dimensional stability. J-STD-020E
Moisture Sensitivity Level (Header) 260 C C Level 1 (MSL1)
Mixed Flowing Gas 336 hours Durability preconditioning: 50 cycles. Mated with wear: 336 hours. Tested on 30pin, 0.76 m (30 ") contact plating. EIA-364-65B Class IIA
Humidity Temperature Cycling 10 Days No physical abnormalities. 10 milliohm max R contact resistance per mated interface throughout testing. EIA-364-31, Method III, Fig 1, +25 to +65 C 80 to 100 % RH -10
Cable Accommodation 30 AWG, 0.025" pitch, stranded or solid conductor, flat cable, PVC, TPE, FEP, PO insulation

2411220419_3M-3448-45110_C17382040.pdf

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