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wire to board connectivity solution featuring 3M 3448-45120 with 1.27mm pitch socket and header assembly

Manufacturer:
3M
Description:
Rectangular Connector Accessories RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Accessories
Specifications
Mfr. Part #:
3448-45120
Model Number:
3448-45120
Introduction

Product Overview

The 3M Ribbon Cable Socket and Header, 451 and 452 Series, offers a 1.27mm (0.050") pitch solution for wire-to-board connectivity. This series includes the 3M Ribbon Cable Wiremount Socket Assembly, 451 Series, and the 3M Shrouded Boardmount Header Latch and Eject, 452 Series. Designed for reliable performance, these connectors accommodate various cable types and are suitable for applications requiring robust electrical and mechanical integrity. They are tested to meet stringent industry standards for temperature, insulation resistance, current rating, and mechanical stress.

Product Attributes

  • Brand: 3M
  • Series: 451 Series (Wiremount Socket Assembly), 452 Series (Shrouded Boardmount Header Latch and Eject)
  • Pitch: 1.27mm (0.050")
  • Socket Insulation Material: Glass filled PBT, 94V-0
  • Cover Insulation Material: Glass filled PBT, 94V-0
  • Strain Relief Material: Stainless Steel
  • Socket Contact Material: BeCu
  • Header Insulation Material: Glass filled LCP, 94V-0
  • Header Pin Material: Phosphor Bronze
  • Agency Listings: Underwriters Laboratories (UL), CUL

Technical Specifications

Specification Value/Limit Units Requirement/Conditions Test Standard/Method
Temperature Range (EIA) -65 to +125 C
Insulation Resistance >1 x 109 at 500 VDC
Current per EIA-364-70 (4-30 poles) 0.75 / 1.50 A All contacts powered / 6 contacts powered Method 2, 30C max temp rise
Current per EIA-364-70 (32-50 poles) 0.75 / 1.50 A All contacts powered / 6 contacts powered Method 2, 30C max temp rise
UL Ratings (4-50 poles) Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 1.0 A File No. E68080
CUL Ratings (4-30 poles) Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 1.0 A
CUL Ratings (32-50 poles) Temp: 130 C, Voltage: 125 Vac/Vdc, Current: 0.75 A
Ratings Voltage 125 Vdc/ac (peak)
Dielectric Withstanding Voltage 1250 VDC 1 minute duration, no disruptive discharge EIA-364-20 Method A Test Condition I
Dielectric Breakdown Voltage 1250 VDC Ramp at 500V/s EIA-364-20 Method A Test Condition I
Low Level Connection Resistance (LLCR) <10 / <30 mOhm Max R per mated interface; <30mOhm for Temp Life, <10mOhm for others EIA-364-23
Header Pin Retention 4.5 (MIN) Newtons/pin Average/pin EIA-364-29
Vibration 3.10 g (gravitational force) Random/Swept-sine, no discontinuities >10ns, max R 10 milliohm EIA-364-28 / IEC-60512-6d-2e-6c
Mechanical Shock 30 g (gravitational force) Half-sine, 11ms, no discontinuities >10ns, max R 10 milliohm EIA-364-27
Durability (Full) 100 / 25 / 20 Mating cycles (30" Au, 4-30p) / (30" Au, 32-50p) / (Flash Au) EIA-364-13
Mating Force / Contact 1.25 (MAX) Newtons/pin Connector average/pin, without friction bumps EIA-364-13 Method B
Unmating Force / Contact 0.4 (MIN) Newtons/pin Connector average/pin, without friction bumps EIA-364-18
Plating Thickness (Tin) 5.08-10.2 (200-400) m (") Soldertail EIA-364-48 Method C
Plating Thickness (Nickel) 1.27-3.81 (50-150) m (") EIA-364-48 Method C
Plating Thickness (Gold) 0.76 min (30) m (") ASTM B488-01 Class C Flash / Matte EIA-364-48 Method C
Solderability (Header) 95% coverage of solderable area, as-received hours EIA-364-52
Temperature Life (Full) 1008 / 125 hours / C No physical abnormalities, 30 milliohm max R EIA-364-17 Method A Condition 5D
Thermal Shock -65 to +125 C No physical abnormalities, 10 milliohm max R EIA-364-32, Table 2, Condition II
Moisture Sensitivity Level (Header) Level 1 260 C, J-STD-020E
Mixed Flowing Gas 336 hours Durability preconditioning: 50 cycles, Mated with wear, Tested on 30pin, 0.76 m (30 ") gold plating EIA-364-65B Class IIA
Humidity Temperature Cycling 10 Days No physical abnormalities, 10 milliohm max R EIA-364-31, Method III, Fig 1

2411220419_3M-3448-45120_C17262488.pdf

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