Home > Products > IC Sockets >IC Sockets > Open top BGA sockets 3M 7100148803 with excellent airflow and wide package thickness accommodation

Open top BGA sockets 3M 7100148803 with excellent airflow and wide package thickness accommodation

Manufacturer:
3M
Description:
IC Sockets RoHS
Category:
IC Sockets/IC Sockets
Specifications
Mfr. Part #:
7100148803
Model Number:
7100148803
Introduction

Product Overview

The 3M Textool 0.65 mm pitch, Open Top, BGA Test & Burn-In Sockets (Type II) are designed for reliable testing and burn-in of BGA devices. These sockets accommodate a wide range of package thicknesses without adaptation, ensuring excellent air flow around the device. Featuring a retractable locating guide for easy board mounting and compatibility with most robotic handlers, they offer easy manual operation. The double beam contact system delivers balanced, opposing forces to the solder ball with minimal shear stress, and contact tips touch the ball above its center plane, resulting in slight indentations and negligible deformation. An optional package retainer is available for enhanced holddown protection in high shock or vibration environments.

Product Attributes

  • Brand: 3M Textool
  • Type: Type II
  • Body Material: Polyethersulfone (PES)
  • Body Flammability: UL 94V-0
  • Body Color: Black
  • Contact Material: Beryllium Copper
  • Contact Plating: Gold over Nickel
  • Other Metal Parts Material: Stainless Steel
  • Marking: 3M Logo/Textool

Technical Specifications

Specification Details
Pitch 0.65 mm
Operating Temperature Rating -55 C to +150 C
Insulation Resistance >1000M at 100 Vdc
Dielectric Withstanding Voltage 100 Vrms at Sea Level
Initial Contact Resistance <50m (at 1.0 mA applied current)
Current Rating 0.5 A max @ 25C
Durability 20,000 actuations (10,000 devices load/unload) at room temperature
Initial Contact Force 8.5gf (0.087N) Nom for 0.4 mm diameter solder ball
Initial Operating Force Type II 5Kg Max @ Full Pin Count
Contact Wiper Gap (Fully Open) 0.55 mm Nom
Max Package Size 25 x 25
Max Matrix 625X
Ball Diameter 0.35 - 0.45 mm
Min Ball Height 0.30 mm
Max PCB Thickness 1.6 mm
PCB Hole Diameter (Min) 0.22 mm
PCB Hole Diameter (For Locating Posts on Socket Base) 2X 2.10 - 2.18
PCB Hole Diameter (For Mounting Screws) 2X 2.20 - 2.30
PCB Hole Diameter (For Locating Posts on Socket Alignment Plate) 2X 1.55 - 1.60
Contact Tail 0.12 x 0.15 mm SQ
Standoffs 0.5 mm

2411271805_3M-7100148803_C20265369.pdf

Send RFQ
Stock:
MOQ: