High Temperature Resistant Chip Carrier Socket 3M 8484-21B1-RK-TP with Open Top Design and RoHS Compliance
Product Overview
The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are also compatible with automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are available, and the product is RoHS Compliant.
Product Attributes
- Brand: 3M
- Product Line: 3M Chip Carrier Sockets
- Series: 8400 Series
- Compliance: RoHS Compliant (RIA E1 and C1 apply)
- Insulation Material: Glass Filled Polyphenylene Sulfide (PPS)
- Insulator Flammability: UL 94V-0
- Insulator Color: Black
- Contact Material: Copper Alloy
- Contact Underplating: 50 " [ 1.27 m ] Nickel
- Contact Wiping Area Plating: 160 " [ 4.06 m ] Matte Tin
- Moisture Sensitivity Level: 1 (per J-STD-020C)
Technical Specifications
| Specification | Value | Units |
|---|---|---|
| Contact Resistance | 15 | m |
| Insulation Resistance | >103 | M minimum |
| Capacitance | <1 | pF at 1 MHz |
| Temperature Rating | -40 to +105 | C |
| Process Rating (Max) | 260 | C (single pass, per J-STD-020C) |
Ordering Information
Note: For Tape and Reel Packaging dimensions, contact 3M customer service or your preferred 3M distributor.
| Contact Quantity | A (mm [Inch]) | B (mm [Inch]) | C (mm [Inch]) | D (mm [Inch]) | E (mm [Inch]) | F (mm [Inch]) | G (mm [Inch]) | H (mm [Inch]) | Alignment Feature | Packaging |
|---|---|---|---|---|---|---|---|---|---|---|
| 20 | 15.65 [0.616] | 15.65 [0.616] | 5.08 [0.200] | 5.08 [0.200] | 10.03 [0.395] | 10.03 [0.395] | 12.70 [0.500] | 6.35 [0.250] | A = With Location Post (tube packaging only) B = Without Location Post | TP = Tube Pack TR = Tape and Reel |
| 28 | 18.18 [0.716] | 18.18 [0.716] | 7.62 [0.300] | 7.62 [0.300] | 12.57 [0.495] | 12.57 [0.495] | 15.24 [0.600] | 7.62 [0.300] | A = With Location Post (tube packaging only) B = Without Location Post | TP = Tube Pack TR = Tape and Reel |
| 32 | 18.18 [0.716] | 20.75 [0.817] | 7.62 [0.300] | 10.16 [0.400] | 12.57 [0.495] | 15.11 [0.595] | 17.78 [0.700] | 7.62 [0.300] | A = With Location Post (tube packaging only) B = Without Location Post | TP = Tube Pack TR = Tape and Reel |
| 44 | 23.28 [0.917] | 23.28 [0.917] | 12.70 [0.500] | 12.70 [0.500] | 17.65 [0.695] | 17.65 [0.695] | 20.32 [0.800] | 10.16 [0.400] | A = With Location Post (tube packaging only) B = Without Location Post | TP = Tube Pack TR = Tape and Reel |
| 52 | 25.84 [1.017] | 25.84 [1.017] | 15.24 [0.600] | 15.24 [0.600] | 20.19 [0.795] | 20.19 [0.795] | 22.86 [0.900] | 11.43 [0.450] | A = With Location Post (tube packaging only) B = Without Location Post | TP = Tube Pack TR = Tape and Reel |
| 68 | 30.95 [1.219] | 30.95 [1.219] | 20.32 [0.800] | 20.32 [0.800] | 25.27 [0.995] | 25.27 [0.995] | 27.94 [1.100] | 13.97 [0.550] | A = With Location Post (tube packaging only) B = Without Location Post | TP = Tube Pack TR = Tape and Reel |
| 84 | 36.00 [1.417] | 36.00 [1.417] | 25.40 [1.000] | 25.40 [1.000] | 30.35 [1.195] | 30.35 [1.195] | 33.02 [1.300] | 16.51 [0.650] | A = With Location Post (tube packaging only) B = Without Location Post | TP = Tube Pack TR = Tape and Reel |
Important Notice: 3M PLCC products are tin plated on the contact wiping surface. This plating is necessary for mated reliability as standard PLCC contacts are also tin plated. Tin whiskers are an inherent characteristic of tin, and mechanical stress can promote whisker growth. It is possible for the PLCC and PLCC socket to exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations, including whisker-mitigating tin plating chemistry, to reduce the likelihood of tin whisker growth. Users should consider the suitability of a PLCC socket for their specific application needs, taking into account product lifespan, environment, mechanical stresses, humidity, and thermal cycling, which can stimulate tin whisker growth.
2410121845_3M-8484-21B1-RK-TP_C5445002.pdf
