3M 150232-2020-RB Boardmount Socket Compatible with Maximum 260 Degree Celsius Reflow Solder Process
Manufacturer:
3M
Description:
Female Header 32 Position 2mm Pitch Dual Row Surface Mount -55℃~+105℃
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Pitch:
2mm
Row Spacing:
2mm
Number Of Rows:
双排
Number Of Pins:
32P
Voltage Rating (Max):
500V
Contact Plating:
锡
Operating Temperature:
-55℃~+105℃
Current Rating:
1A
Mounting Type:
立贴
Mfr. Part #:
150232-2020-RB
Package:
SMD,P=2mm
Model Number:
150232-2020-RB
Introduction
Product Overview
The 3M Boardmount Socket 1502 Series offers a 2 mm x 2 mm pitch for straight surface mount, straight, and right-angle plated through-hole applications. These sockets feature high-temperature insulators, reflow solder compatibility, and a low profile to minimize PCB stack height. They are end stackable, with through-hole versions also being side stackable. Surface mount parts are available in tape and reel packaging with a vacuum cap for automated placement. Designed for reliability, they offer a current rating of 1 A and excellent insulation resistance.
Product Attributes
- Brand: 3M
- Product Line: 1502 Series
- Contact Spacing: 2 mm x 2 mm
- Mounting Type: Straight Surface Mount, Straight Plated Through-Hole, Right Angle Plated Through-Hole
- Insulator Material: Glass Filled LCP (Surface Mount), Glass filled PCT (Vertical Thru-Hole, Right Angle Thru-Hole)
- Contact Material: Copper alloy
- Plating (Underplating): Nickel
- Plating (Wiping Area): Gold
- Plating (Solder Tails): Matte tin or tin-lead
- Temperature Rating: -55C to +105C
- Process Rating: Maximum 260C (per J-STD-020C)
- Moisture Sensitivity Level: 1 (per J-STD-020C)
- Certifications: UL File No. E68080
- RoHS Compliance: RIA E1 & C1 apply (refer to Regulatory Information Appendix)
Technical Specifications
| Specification | Value |
|---|---|
| Contact Quantity (Example from Table 1) | 04 to 60 |
| Dimension A (Contact Quantity) | 3.96 mm [0.156 in] to 59.87 mm [2.357 in] |
| Current Rating | 1 A |
| Insulation Resistance | > 1 109 at 250 VDC |
| Withstanding Voltage | 500 VDC at Sea Level |
| Temperature Rating | -55C to +105C |
| Process Rating | Maximum 260C (per J-STD-020C) |
| Moisture Sensitivity Level | 1 (per J-STD-020C) |
| Nickel Underplating | 1.27-3.81 m [50-150 ] |
| Gold Wiping Area Plating | 0.76 m [30 ] |
| Matte Tin Solder Tails Plating | 5.1 m [200 ] |
| Tin-Lead Solder Tails Plating | 5.1 m [200 ] |
| Board Location Post Option | 0 = None (Standard), 2 = With board location post (Special order) |
| Plating Suffix RB | 0.76 m [30 ] Gold with matte tin solder tails (RIA E1 & C1 apply) |
| Plating Suffix TB | 0.76 m [30 ] Gold with tin-lead solder tails (RIA E3 & C2 apply) |
| Packaging Style WX | Tape & reel pkg |
| Solder Tail Length Dimension B (Example) | 1 = 1.4 mm (Special order), 2 = 2.54 mm (Standard) |
| Standoff Height Code 0 (Dimension B) | 0.38 mm [0.015 in] |
| Standoff Height Code 1 (Dimension B) | 1.35 mm [0.053 in] |
| Standoff Height Code 2 (Dimension B) | 0.71 mm [0.028 in] (Available for 40, 44, and 50 positions only) |
2410311323_3M-150232-2020-RB_C6041996.pdf
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