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Compact scalable connector Amphenol HM2R70PA5108E9LF supporting data rates up to 3 gigabits per second

Manufacturer:
Amphenol
Description:
Hard Metric, Standard RoHS
Category:
ARINC/Hard Metric, Standard
Specifications
Mfr. Part #:
HM2R70PA5108E9LF
Model Number:
HM2R70PA5108E9LF
Introduction

Product Overview

The Millipacs 2mm Hard Metric Series offers a versatile and cost-effective board-to-board interconnection system designed in accordance with IEC 917, IEC 61076-4-101, and Telcordia GR-1217-CORE standards. This popular backplane connector system is ideal for chassis-based packaging in Communications, Data, Energy, Medical, and Industrial & Instrumentation segments. Featuring right-angle receptacle connectors, the Millipacs series provides modularity and scalability, supporting up to 200 signal contacts per 50mm length. Hybrid modules are available with signal, power, and coaxial contacts, enabling flexible circuit design with data rates up to 3Gb/s. Its design offers adequate spacing for PCB trace routing, optimizing board layers and reducing real estate compared to 2.54mm pitch connectors.

Product Attributes

  • Brand: Millipacs
  • Series: 2mm Hard Metric Series
  • Configuration: Hard Metric (HM)
  • Standards: IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE, DIN 43356, IEEE 1301
  • Contact Material: Copper Alloy
  • Contact Plating: Gold/Palladium Nickel on mating areas, Tin over Nickel on press-fit/terminal area
  • Insulator Material: High-temperature Polymer
  • Certifications: UL and CSA recognized
  • Packaging: Tray Packaging
  • Features: Modular, Scalable, 2-beam tulip contact, Multipurpose center (coding, guiding, location peg), Stamped contacts, Blank position feasibility, Hybrid connectors (signal, power, coax), Optional shielding

Technical Specifications

Specification Details
Pitch 2mm
Module Types Standard signal modules (5 and 8 rows), Hybrid modules
Max. Signal Contacts (50mm) 125 (5 row modules), 200 (8 row modules)
Hybrid Contact Options Signal, Power, Coaxial
Data Rate Up to 3Gb/s
Mating Force 0.75N max. per contact pair
Withdrawal Force 0.15N min per contact pair
Hertz Stress 200Kpsi min.
Misalignment (Longitudinal) 2.0mm
Misalignment (Transversal) 2.5mm
Inclination 2.0
Operating Current 1.5A at 20C, 1.0A at 70C
Test Voltage 750Vrms
Contact Resistance 20M max.
Insulation Resistance 104M min.
Operating Temperature Range -55C to +125C
Product Specification GS-12-203
Application Specification GS-20-022
Part Number Example (5 Row) HM2R10P (110 Pins, Press-fit, MPC)
Part Number Example (8 Row) HM2R81P (176 Pins, Press-fit, MPC)
Performance Levels (Mating Cycles) 1 (50), 2 (250), 3 (500)

Target Markets & Applications

  • Communications (IP, Internet Backbone, LAN/WAN Interfaces, Core Switches, Routers, Hubs)
  • Data (Data Over Public Networks, Server Storage Units)
  • Energy (Energy Management Systems)
  • Medical (MRI Scanners, Diagnostic Equipment)
  • Industrial & Instrumentation (Test & Measurements, Control Systems for Process/Factory Automation)
  • Wireless Base Station Transmission
  • Access Systems
  • Railway Traffic Management & Control
  • Avionics (In-flight Entertainment & Communication)
  • Digital Image Processing
  • Video Surveillance
  • Radar, Sonar Systems
  • UAVs

2411200955_Amphenol-HM2R70PA5108E9LF_C3643996.pdf

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