2mm Pitch Modular Connector Amphenol HM2P09PD5110N9LF with Rear Plug Up and Hot Swapping Capabilities
Product Overview
Millipacs is a 2mm modular, Board-to-Board Interconnection system in Hard Metric (HM) configuration. It offers versatility through cost-effectiveness, user flexibility, and a broad range of availability. This system adheres to popular equipment practice standards, ensuring compatibility with all HM connectors and accessories. The 2mm pitch provides adequate spacing for PCB trace routing, optimizing board layers and reducing real estate compared to 2.54mm pitch systems. It is modular and scalable, available in standard lengths without loss of position. With three levels of mating contact lengths and different terminal lengths, Millipacs is suitable for various applications, including those with different PCB thicknesses, rear plug-up, and hot-swapping scenarios. Multipurpose center, coding, and guiding features facilitate easy and error-free mating. The system offers SI performance up to 3Gb/s with suitable pinning assignments and allows for customized loading through hybrid connectors integrating signal, power, and coaxial contacts, enabling versatile circuit designs. The two outer rows offer optional shielding. Millipacs conforms to IEC 917, IEC 61076-4-101, and Telcordia GR-1217-CORE standards, making it suitable for chassis-based packaging in communications, data, medical, industrial, and instrumentation segments. Optional hybrid modules are also available.
Product Attributes
- Brand: Millipacs
- System Type: 2mm modular, Board-to-Board Interconnection system
- Configuration: Hard Metric (HM)
- Standards Conformance: IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE, DIN 43356, IEEE 1301
- Certifications: UL and CSA recognized
- Insulator Material: Thermoplastic UL94 V-0 (standard press-fit), High temperature polymer (Pin-in-Paste terminations)
- Contact Material: Copper Alloy
- Contact Plating Material: Gold / Palladium Nickel (mating area), Tin over Nickel (press-fit/pinin-paste terminal area)
- Packaging: Tray packaging (standard versions), Tape and Reel packaging (Pin-in-Paste versions)
- Performance Levels: 3 (50 mating cycles), 2 (250 mating cycles), 1 (500 mating cycles)
Technical Specifications
| Specification/Model | Details |
|---|---|
| Pitch | 2mm |
| Hard Metric Standard | IEC 917, IEC 61076-4-101 |
| SI Performance | Up to 3Gb/s |
| Operating Current | 1.5A at 20C; 1.0A at 70C |
| Test Voltage | 750Vrms |
| Contact Resistance | 20m max. |
| Insulation Resistance | 104M min. |
| Mating Force | 0.75N max. per contact pair |
| Withdrawal Force | 0.15N min. per contact pair |
| Hertz Stress | 200Kpsi min. |
| Misalignment (Longitudinal) | 2.0mm |
| Misalignment (Transversal) | 2.5mm |
| Operating Temperature Range | -55C to +125C |
| Vertical Header - HM2P07P | 22 column, 50mm + MPC + location peg, 110 positions, Press-fit |
| Vertical Header - HM2P29P | 22 column, 50mm + MPC + Guide pin option + location peg, 110 positions, Press-fit |
| Vertical Header - HM2P27P | 12 column, 30mm + MPC + location peg, 60 positions, Press-fit |
| Vertical Header - HM2P40P | 22 column, 50mm + MPC, 110 positions, Press-fit |
| Vertical Header - HM2P08P | 25 column, 50mm, 125 positions, Press-fit |
| Vertical Header - HM2P70P | 22 column, 44mm, 110 positions, Press-fit |
| Vertical Header - HM2P71P | 19 column, 38mm, 95 positions, Press-fit |
| Vertical Header - HM2P78P | 8 column, 16mm, 40 positions, Press-fit |
| Vertical Header - HM2P65P | 25 column, 44mm + polarization on housing walls, 110 positions, Press-fit |
| Vertical Header - HM2P66P | 22 column, 44mm + polarization on housing walls, 110 positions, Press-fit |
| Vertical Header - HM2P67P | 19 column, 38mm + polarization on housing walls, 95 positions, Press-fit |
| Vertical Header - HM2P09P | 11 column, 25mm + end polarization + location peg, 55 positions, Press-fit |
| Vertical Header - HM2P80P | 11 column, 25mm + reversed + end polarization + location peg, 55 positions, Press-fit |
| Vertical Header - HM2A30P | 50mm, 6 power/coax + MPC, 6 positions, Spl. Press-fit |
| Vertical Header - HM2P11P | 50mm, 55 signal + 3 power/coax + MPC, 3 + 55 positions, Spl. Press-fit |
| Vertical Header - HM2A32P | 25 mm, 3 power/coax + end polarization, 3 positions, Spl. Press-fit |
| Vertical Header - HM2P87P | 22 column, 50mm + MPC + guide pin option + location peg, 176 positions, Press-fit |
| Vertical Header - HM2P95P | 25 column, 50mm + polarization on walls, 200 positions, Press-fit |
| Vertical Header - HM2P88P | 25 column, 50mm, 200 positions, Press-fit |
| Vertical Header - HM2P89P | 11 column, 25mm + end polarization + location peg, 88 positions, Press-fit |
| Vertical Header - HM2P40S | 22 column, 50 mm + MPC, 110 positions, Pin-in-Paste |
| Vertical Header - HM2P09S | 11 column, 25mm + end polarization + location peg, 55 positions, Pin-in-Paste |
| Vertical Header - HM2P11S | 50 mm, 55 signal + 3 power/coax + MPC, 3 + 55 positions, Pin-in-Paste |
| Target Markets/Applications | IP, Internet backbone, LAN/WAN interfaces, Core Switches, Routers, Hubs, Base Stations, Transmission Access Systems, Servers, Storage Units, Energy Management Systems, Data Acquisition systems, Control Systems, Railway Traffic Management, Renewable Energy, Avionics, Digital Image Processing, Video Surveillance, Sonar Systems, MRI Scanners, Diagnostic Equipment |
2411261521_Amphenol-HM2P09PD5110N9LF_C3643414.pdf
