Home > Products > ARINC >DIN 41612 > backplane connector Amphenol 86093968124H55V1LF with beam on beam contact interface and rear plug up feature

backplane connector Amphenol 86093968124H55V1LF with beam on beam contact interface and rear plug up feature

Manufacturer:
Amphenol
Description:
Through Hole,P=2.54mm DIN 41612 RoHS
Category:
ARINC/DIN 41612
Specifications
Number Of Pins:
-
Mfr. Part #:
86093968124H55V1LF
Package:
Through Hole,P=2.54mm
Model Number:
86093968124H55V1LF
Introduction

Product Overview

Amphenol ICC's DIN 41612 Headers and Receptacles are robust backplane interconnect systems designed for harsh environments, offering both board-to-board and I/O capabilities. Adhering to IEC 603-2 specifications, these connectors are favored for their widespread adoption, cost-effectiveness, and durability. Available in standard and reverse mount configurations, they support up to three rows and a maximum of 96 positions with solder, press-fit, and pin-in-paste terminations. Key features include a revolutionary beam-on-beam contact interface, selective loading patterns for custom configurations, and Rear Plug-Up (RPU) capability for extended mating applications. These connectors are inter-mateable and interchangeable with industry standards, providing standardized and cost-effective solutions for a wide range of target markets including switching, enterprise, transmission, and transportation electronics.

Product Attributes

  • Brand: Amphenol ICC
  • Standard Compliance: DIN 41612, IEC 603-2
  • Material - Insulator: Polyester thermoplastic
  • Material - Contact: Copper alloy (male & female contact)
  • Plating: Lead-free version; Gold over Nickel or GXT over Nickel on mating surface; Tin over Nickel on solder termination
  • Certifications: UL, NFF 16-101/102, EN45545-2
  • Packaging: Tray, Tube, Carton

Technical Specifications

Specification Details
Pitch 2.54mm and 5.08mm
Positions/Rows Up to 96 positions, up to 3 rows
Termination Types Solder-to-board, Press-fit, Pin-in-paste
Contact Interface Revolutionary beam-on-beam
Mounting Options Standard mount, Reverse mount
Mating Insertion Force per Contact 0.94N
Mating Extraction Force per Contact 0.15N
Contact Retention in Insulator 20N
Vibration/Shock ( 1s) 40m
Current Rating at 20C 1.5A
Maximum Current 2A
Contact Resistance 20m
Insulation Resistance 106M
Test Voltage (rms) 1000V
Creepage and Clearance Distance 1.2mm
Wiping/Plug-in Direction 1.8mm
Temperature Range -55C to +125C
Damp Heat Steady state 56 days: Class 1; Steady state 21 days: Class 2
High Temperature Resistance Housings withstand lead-free wave soldering temperatures of 260C to 265C with appropriate adhesive or protective device for right angle connectors.
Performance Class (Part Number Suffix) Class 1 (6), Class 2 (5), Class 3 (4)

Target Markets/Applications

  • Switching/Routing
  • Enterprise Transmission
  • Access - wired/wireless
  • Home Entertainment
  • White Goods
  • Phones
  • Servers
  • Personal Computing
  • Peripheral Device
  • Medical
  • Lighting
  • Process Control
  • Transportation
  • Instrumentation
  • Vehicle Electronics
  • Energy Transmission/Distribution
  • Control

2411200955_Amphenol-86093968124H55V1LF_C3651153.pdf

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