board to board interconnect solutions featuring Amphenol MH3 connectors for high density applications
Manufacturer:
Amphenol
Description:
D-Sub, D-Shaped Connector Contacts RoHS
Category:
Centronics Connectors/D-Sub, D-Shaped Connector Contacts
Specifications
Mfr. Part #:
MH3
Model Number:
MH3
Introduction
Product Overview
Amphenol Socapex offers a comprehensive range of board-to-board interconnect solutions designed for high-density applications and harsh environments. The product portfolio includes modular and hybrid connectors, high-density monolithic connectors, and specialized interconnect systems. These connectors are engineered to provide reliable performance in demanding markets such as military and commercial avionics, industrial automation, railway, and aerospace. Key features include high contact density, robust construction, compatibility with various termination styles, and options for hybrid configurations with signal, power, coaxial, and fiber optic contacts.
Product Attributes
- Brand: Amphenol
- Subsidiaries: Amphenol Socapex (France, India, China, USA)
- Certifications/Standards: MIL-DTL-38999, MIL-DTL-26482 Series I, EN2997, MIL-DTL-55302, RoHS directive compliant
- Materials: Brass, Stainless Steel, LCP Thermoplastic, CuBe, Aluminum, Phosphorous Bronze, Beryllium Copper
- Contact Technology: Starclip, Tuning Fork and Blade, Brush Contact
Technical Specifications
| Product Family | Key Feature | Pitch | Rows | Contact Density | Current Rating (Signal) | Mating Cycles | Vibration Resistance | Temperature Range |
|---|---|---|---|---|---|---|---|---|
| HiLinX 2.54 | Modular & Hybrid Connector | 2.54 x 2.54 [.100 x .100] | 2 or 3 | 0.11 cts/mm [71 cts/in] | 5 A | 500 | 15 g (sinusoidal) | -65 / +150 C |
| HiLinX 1.905 | High Density Modular & Hybrid Connector | 1.905 x 1.905 [.075 x .075] | 2 or 3 | 0.16 cts/mm [103 cts/in] | 3 A | 500 | 15 g (sinusoidal) | -65 / +150 C |
| HDAS | High Density Monolithic Connector | 1.905 x 1.905 [.075 x .075] | 3 to 6 | 0.16 cts/mm [103 cts/in] | 4.5 A | 500 | 15 g (sinusoidal) | -65 / +150 C |
| SMASH | High Density Interconnect System for Harsh Environments | 1.905 x 1.905 [.075 x .075] | Up to 8 | 0.34 cts/mm [130 cts/in] | 3 A | 500 | 15 g (sinusoidal) | -65 / +150 C |
| SIAL | Hybrid Connector with Thermal Clamp Compatibility | 2.54 x 1.905 [.100 x .075] | 5 | 0.14 cts/mm [90 cts/in] | 3 A | 500 | 10 g (sinusoidal) | -55 / +125 C |
| SIHD | Monolithic Connector with Thermal Clamp Compatibility | 2.54 x 1.905 [.100 x .075] | 5 | 0.14 cts/mm [90 cts/in] | 3 A | 500 | 10 g (sinusoidal) | -55 / +125 C |
| 127 / HE8 | Proven, Reliable, Robust PCB Connector | 2.54 x 2.54 [.100 x .100] | 2 or 3 | 0.11 cts/mm [71 cts/in] | 3 A | 500 | 10 g (sinusoidal) | -55 / +125 C |
| HDB3 / HSB3 | High Density Brush Contact Technology | 0.070 x 0.060 inch staggered grid | 8 | Higher density than standard LRM | N/A | N/A | 10 g (sinusoidal) | N/A |
| LRM (SEM-E) | Modular Interconnect for Integrated Electronic Modules | 0.100 inch spacing / 0.050 inch between rows | 8 | High contact density | N/A | N/A | 10 g (sinusoidal) | N/A |
| Ruggedized VME64x | Rugged Interface for Harsh Environments | Standard VME64x | 3 modules | N/A | 1 A (signal) / 12 A (power wafer) | 500 | 50 Grms (shocks) | -55 / +125 C |
| VIPER (VITA 46/48/60) | High Density, High Speed Modular Interconnect | 1.8mm x 1.35mm grid | N/A | High density | 1 A (signal) / 12 A (power) | 500 | 50 Grms (shocks) | -55 / +125 C |
2412101653_Amphenol-MH3_C20218455.pdf
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