SFP Single Cage with Solder Pins Amphenol U77A11133001 High Speed Interconnects Copper Alloy Material
Product Overview
The Amphenol High Speed Interconnects SFP Single Cage with Solder Pins is designed for high-speed data applications. This product offers various solder tail heights and plating options to meet specific design requirements. It is available with or without an optional dust cover and is supplied in tray or tape & reel packaging.
Product Attributes
- Brand: Amphenol High Speed Interconnects
- Division: A Division of Amphenol Corp.
- Material (Cage): Copper Alloy
- Material (Dust Cover): Thermiplastic
- Color (Dust Cover): Black
- RoHS Compliant: Yes
Technical Specifications
| Model Series | Solder Tail Height (mm) | Cage Plating Option | Packaging Option | Optional Dust Cover | Temperature Range |
|---|---|---|---|---|---|
| U77-A1112-XX0X | 1.20 | Bright Tin (1) or Matte Tin (3) | Tray (1) or Tape & Reel (R, T) | No Dust Cover (0), Standard (D), Special (S) | -40C to +85C |
| U77-A1113-XX0X | 3.20 | Bright Tin (1) or Matte Tin (3) | Tray (1) or Tape & Reel (R, T) | No Dust Cover (0), Standard (D), Special (S) | -40C to +85C |
| U77-A1114-XX0X | 1.80 | Bright Tin (1) or Matte Tin (3) | Tray (1) or Tape & Reel (R, T) | No Dust Cover (0), Standard (D), Special (S) | -40C to +85C |
| Plating Option 1: | 2.54 m Min. Bright Tin Plating over 1.27 m Min. Nickel Under Plating. (Bright Tin Solder Temperature 230C Max.) | ||||
| Plating Option 3: | 2.54 m Min. Matte Tin Plating over 1.27 m Min. Nickel Under Plating. (Matte Tin Solder Temperature 245C Max. in 10 seconds of peak time) | ||||
| Packaging: | Tray (1), Tape & Reel (R, T) | ||||
| Optional Dust Cover: | No Dust Cover (0), Standard Dustover (D - Ship Loose), Special Dustover (S - Ship Loose) | ||||
Note: Part number configuration is P-U77-A111X-XX0X.
2411271540_Amphenol-U77A11133001_C5355132.pdf