Surface Mount DDR5 DIMM Socket 288 Contacts Amphenol DDR504111002KQ for Memory Expansion in Server and Workstation
Manufacturer:
Amphenol
Description:
Surface Mount,Vertical 288P SMD Inline Module Sockets RoHS
Category:
Inline Module Sockets/Inline Module Sockets
Specifications
Mounting Type:
立贴
Number Of Pins:
288P
Mfr. Part #:
DDR504111002KQ
Package:
SMD
Model Number:
DDR504111002KQ
Introduction
Product Overview
Amphenol ICC's Vertical DDR5 DIMM sockets are designed to meet the JEDEC SO-023 standard and accept DDR5 memory modules conforming to JEDEC MO-329. These SMT sockets feature a 0.85mm pitch and 288 contacts, offering convenient memory expansion for servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. They are engineered to withstand high system-level shock and vibration, optimize airflow, and support thicker multilevel motherboards, while also reducing energy consumption and enabling faster data rates.
Product Attributes
- Brand: Amphenol ICC
- Standard Compliance: JEDEC SO-023, JEDEC MO-329
- Termination Type: Surface Mount (SMT)
- Certifications: UL E66906
- Housing & Latch Colors: Available in different color options for visual identification
- Material - Contacts: Copper alloy with Gold flash or 15 in min. of gold or 30 in min. of gold (Contact area), Tin or matte tin plating (Solder Area), Nickel plating over all (Underplate)
- Material - Insulator: High temperature, thermal plastic (UL94V-0)
- Material - Boardlock: Copper alloy, Tin plating (Solder Area), Nickel plating overall (Underplate)
- Packaging: Tray
Technical Specifications
| Specification | Details |
|---|---|
| Contact Pitch | 0.85mm |
| Number of Contacts | 288 |
| Voltage Rating | 30V AC (RMS)/DC |
| Current Rating | 1.0 Amps/pin max. |
| Insertion Force (Total) | 35N max. |
| Insertion Force (Module) | 106.8N max. |
| Withdrawal Force (Module) | 19.77N min. |
| Retention Force (Contact) | 300gf min. per pin |
| Retention Force (Boardlock) | 13.3N min. |
| Durability | 25 cycles |
| Latch Overstress Force | 3.5kg min. force held for 10s with no damage |
| Latch Actuation Force | 4.0kgf max. per latch |
| Module Rip Out Force | 9.1kgf min. retention force of the module in connector with no damage |
| Retention of Connector to PCB | No lifting of connector from applicable PCB |
| Temperature Rise | 30C max. |
| Solderability | 95% min. |
| Resistance to Soldering Heat | Visual-no damage or discoloration of connector materials |
| Amphenol Product Specification | S-DDR-005 |
| Amphenol Packaging Specification | PKSDDR5002 |
| Amphenol Application Specification | S-DDR-006 |
| Part Number Example | DDR504* (*denotes base part number. Please contact Amphenol ICC for complete part numbers.) |
2412161842_Amphenol-DDR504111002KQ_C4664763.pdf
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