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High density mezzanine connector Amphenol 61083-042402LF designed for PCIe Gen 2 and SAS 3 0 compatibility

Manufacturer:
Amphenol
Description:
40 Position Board to Board Connector Surface Mount,P=0.8mm Gold
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
System Fit Height:
-
Pitch:
0.8mm
Number Of Rows:
2
Number Of Pins:
40P
Contact Plating:
Mounting Type:
立贴
Mfr. Part #:
61083-042402LF
Package:
SMD,P=0.8mm
Model Number:
61083-042402LF
Introduction

Product Overview

The Amphenol BergStak 0.8mm is a flexible, high-density mezzanine connector system designed for parallel board-to-board applications. It offers support for up to 12Gb/s, compatible with PCIe Gen 2/3 and SAS 3.0 on selected stack heights. With 16 PCB stack heights ranging from 5mm to 20mm and 12 sizes from 40 to 200 positions, it provides a comprehensive solution for various electrical needs. Key features include a scoop-proof design to prevent reverse mating, multiple plating and packaging options, PCB locator pegs for assembly accuracy, and UL94-V0 material for high flammability rating. This connector system is suitable for demanding markets such as IP Phones, Routers, Servers, Industrial and Instrumentation, Office Equipment, Point-Of-Sale Terminals, Portable Industrial Terminals, Test and Measurement, and Diagnostic Systems.

Product Attributes

  • Brand: Amphenol BergStak
  • Contact Pitch: 0.8mm
  • Mating Configuration: Vertical versus vertical
  • Material (Housing): Glass filled LCP, UL94V-0
  • Material (Receptacle Contact Base Metal): Copper Alloy, High Spring
  • Material (Plug Contact Base Metal): Brass
  • Contact Area Finish Options: Gold or Gold flash over Palladium-nickel (GXT) over Nickel
  • Solder Area Finish: Matte pure Tin over Nickel
  • Environmental Compliance: RoHS compliant and lead-free
  • Approvals: UL E66906, File no. LR46923
  • Product Specification: GS-12-547
  • Test Report: DGS-29-010

Technical Specifications

Specification Details
Positions 40 to 200 positions (in 20 position increments)
Stack Heights 5mm to 20mm (in 1mm increments)
Signal Speed Support Up to 12Gb/s (Housing and terminal profile guarantees)
High-Speed Compatibility PCIe Gen 2/3 and SAS 3.0 on selected stack heights
Durability 100 mating cycles
Mating Force 0.9N max./contact
Unmating Force 0.1N min./contact
Insulation Resistance Initial: 1000M min. / After Test: 100M min.
Current Rating 0.8A/contact
Contact Resistance Initial: 30m max. / After Test: 50m max.
Voltage Rating 100VAC
Signal Integrity (Differential Pairs) Impedance Range: 81 to 108 @ 50 ps edge (10-90%)
Return Loss < 10dB up to 5GHz
Insertion Loss < 1.5dB up to 5GHz
NEXT 4.0% for a 50 ps edge (10-90%)
FEXT 2.4% for a 50 ps edge (10-90%)
Temperature Range -40C to +125C
High Temperature Life Test 105C 5C for 1000 hours
Humidity Test 90-95% relative humidity for 96 hours
Mixed Flowing Gas Test Class 2a (30 GXT)
Packaging Options Tape & Reel, Tubes

2412161832_Amphenol-61083-042402LF_C3640574.pdf

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