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Self alignment 050mm pitch board to board connector Amphenol 10156001-051100LF for electronic assembly

Manufacturer:
Amphenol
Description:
nan
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
System Fit Height:
-
Pitch:
0.5mm
Number Of Rows:
2
Number Of Pins:
50P
Contact Plating:
Mounting Type:
立贴
Mfr. Part #:
10156001-051100LF
Package:
SMD,P=0.5mm
Model Number:
10156001-051100LF
Introduction

Product Overview

The BergStak 0.50mm Self-Alignment Board-to-Board Connector is engineered for high-density applications requiring blind mating capabilities. Its unique self-alignment feature accommodates 0.85mm in pitch and 1.29mm in width, facilitating automatic assembly and reducing manufacturing costs. The scoop-proof housings protect terminals from damage during mating, ensuring reliable contact and improved manufacturing quality. With a fine 0.50mm pitch and a vertical mating configuration, this connector is ideal for parallel board stacker applications where space is a constraint. It supports PCIe Gen 1 speeds of 2.5Gb/s and is constructed from UL94V-0 rated high-temperature LCP material, meeting stringent health, safety, and environmental requirements.

Product Attributes

  • Brand: BergStak
  • Connector Type: Board-to-Board Connector
  • Pitch: 0.50mm
  • Housing Material: High temperature thermoplastic LCP, Black (UL94V-0)
  • Certifications: RoHS compliant, halogen and lead free
  • Packaging: Tape & Reel

Technical Specifications

Specification Details
Self-Alignment Capability 0.85mm (Pitch), 1.29mm (Width)
Stack Height 3mm (for 50 positions)
Available Positions 50 positions; extendable from 20 to 60 positions upon request (in increments of 10)
Contact Type Double row contacts
Mating Configuration Vertical
Flammability Rating UL94V-0
Current Rating 0.5A per contact
Voltage Rating 100VAC
LLCR (Initial) 30m max.
LLCR (After Test) 50m max.
Insulation Resistance 1000M min.
Data Rate Support PCIe Gen 1 (2.5Gb/s)
Mating Force 0.8N per pin max.
Unmating Force 0.15N per pin min.
Retention Force 0.98N per pin min.
Durability 50 mating cycles
Operating Temperature Range -40C to +125C
High Temperature Exposure Withstands 260C for 40 seconds
Material - Receptacles Copper Alloy
Material - Headers Copper Alloy
Plating (Contact Area) 2in Au over 15in min. Pd-Ni
Plating (Solder Area) 2in min. Au
Product Specification GS-12-1298
Part Numbers Description
10156000-051100LF BergStak 0.50mm Self-Alignment BTB Conn, Vertical Receptacle, 50 Positions
10156001-051100LF BergStak 0.50mm Self-Alignment BTB Conn, Vertical Header, 50 Positions

Target Markets/Applications

  • Automotive Camera
  • 5G AAU
  • Home Automation
  • IoT Devices
  • Factory Automation Camera
  • Embedded Computer

2411261521_Amphenol-10156001-051100LF_C3643393.pdf

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