scoop proof housing connector Amphenol 61083-043402LF designed for PCIe Gen 2 3 and SAS 3 0 standards
Manufacturer:
Amphenol
Description:
0.8mm 2 40P Surface Mount,Vertical SMD,P=0.8mm Arrays, Edge Type, Mezzanine (Board to Board) RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
System Fit Height:
-
Pitch:
0.8mm
Number Of Rows:
2
Number Of Pins:
40P
Contact Plating:
金
Mounting Type:
立贴
Mfr. Part #:
61083-043402LF
Package:
SMD,P=0.8mm
Model Number:
61083-043402LF
Introduction
Product Overview
The Amphenol BergStak 0.8mm is a flexible, high-density parallel board-to-board connector system designed for high-speed applications. It offers a comprehensive range of 16 PCB stack heights across 9 sizes, supporting up to 200 positions. This connector system is ideal for applications requiring robust performance, such as routers, servers, industrial equipment, and test and measurement systems. Its design ensures compatibility with high-speed standards like PCIe Gen 2/3 and SAS 3.0, while features like scoop-proof housings and multiple plating options enhance reliability and application flexibility. The 0.8mm double-row contact pitch conserves valuable PCB space, making it a superior choice for modern, compact electronic designs.
Product Attributes
- Brand: Amphenol
- Product Line: BergStak
- Contact Pitch: 0.8mm
- Material (Housing): Glass filled LCP, UL94V-0
- Certifications: UL E66906, File no. LR46923
- Compliance: RoHS compliant and lead-free
- Flammability Rating: UL94-V0
- Packaging Options: Tape & Reel, Tubes
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | BergStak 0.8mm Mezzanine Connector |
| Application Focus | High density, high speed, parallel board-to-board applications |
| Position Sizes | 40 to 200 positions (in 20 position increments) |
| Stack Heights | 5mm to 20mm (in 1mm increments) |
| High-Speed Support | Up to 12Gb/s (guaranteed by housing and terminal profile) |
| Compatibility | PCIe Gen 2/3 and SAS 3.0 on selected stack heights |
| Mating Configuration | Vertical versus vertical |
| Durability | 100 mating cycles |
| Mating Force | 0.9N max./contact |
| Unmating Force | 0.1N min./contact |
| Current Rating | 0.8A/contact |
| Voltage Rating | 100VAC |
| Operating Temperature Range | -40C to +125C |
| Signal Integrity (Differential Pairs) | Impedance Range: 81 to 108 @ 50 ps edge (10-90%) Return Loss: < 10dB up to 5GHz Insertion Loss: < 1.5dB up to 5GHz NEXT: 4.0% for a 50 ps edge (10-90%) FEXT: 2.4% for a 50 ps edge (10-90%) |
| Contact Base Metal | Copper Alloy (Receptacle), Brass (Plug) |
| Contact Area Finish Options | Gold or Gold flash over Palladium-nickel (GXT) over Nickel |
| Solder Area Finish | Matte pure Tin over Nickel |
| PCB Locator Pegs | Option available |
| Product Specification Document | GS-12-547 |
| Test Report Document | DGS-29-010 |
Target Markets/Applications
- IP Phones
- Routers
- Servers
- Industrial and Instrumentation
- Office Equipment
- Point-Of-Sale Terminals
- Portable Industrial Terminals
- Test and Measurement Systems
- Diagnostics Systems
2410121850_Amphenol-61083-043402LF_C561681.pdf
Send RFQ
Stock:
MOQ:
