High speed board to board connector Amphenol 61082-044402LF with 0.8mm pitch and up to 200 positions
Product Overview
The Amphenol BergStak 0.8mm is a flexible, high-density parallel board-to-board connector system designed for high-speed applications. With 16 PCB stack heights across 9 sizes and up to 200 positions, it offers a comprehensive solution for demanding electrical applications. Its housing and terminal profile supports up to 12Gb/s, making it compatible with PCIe Gen 2/3 and SAS 3.0 on selected stack heights. The vertical-to-vertical mating configuration is ideal for parallel board stacking. Key features include a scoop-proof design to prevent reverse mating, multiple plating and packaging options, and optional PCB locator pegs for assembly accuracy. This connector system meets RoHS compliance and is available in UL94-V0 material for high flammability rating.
Product Attributes
- Brand: Amphenol BergStak
- Product Type: Mezzanine Connector
- Contact Pitch: 0.8mm
- Mating Configuration: Vertical versus vertical
- Certifications: UL E66906, File no. LR46923
- Material (Housing): Glass filled LCP, UL94V-0
- Material (Receptacle Contact Base Metal): Copper Alloy, High Spring
- Material (Plug Contact Base Metal): Brass
- Environmental Compliance: RoHS compliant and lead-free
Technical Specifications
| Specification | Details |
|---|---|
| Positions | 40 to 200 positions (in 20 position increments) |
| Stack Heights | 5mm to 20mm (in 1mm increments) |
| High-Speed Performance | Supports up to 12Gb/s (Housing and terminal profile) |
| Compatibility | PCIe Gen 2/3 and SAS 3.0 on selected stack heights |
| Durability | 100 mating cycles |
| Mating Force | 0.9N max./contact |
| Unmating Force | 0.1N min./contact |
| Insulation Resistance (Initial) | 1000M min. |
| Insulation Resistance (After Test) | 100M min. |
| Current Rating | 0.8A/contact |
| Contact Resistance (Initial) | 30m max. |
| Contact Resistance (After Test) | 50m max. |
| Voltage Rating | 100VAC |
| Signal Integrity (Impedance Range) | 81 to 108 @ 50 ps edge (10-90%) |
| Signal Integrity (Return Loss) | < 10dB up to 5GHz |
| Signal Integrity (Insertion Loss) | < 1.5dB up to 5GHz |
| Signal Integrity (NEXT) | 4.0% for a 50 ps edge (10-90%) |
| Signal Integrity (FEXT) | 2.4% for a 50 ps edge (10-90%) |
| Temperature Range | -40C to +125C |
| High Temperature Life | 105C 5C for 1000 hours |
| Humidity | 90-95% relative humidity for 96 hours |
| Mixed Flowing Gas | Class 2a (30 GXT) |
| Contact Area Finish Options | Gold 0.2um min./Pure Tin 2um min. (Lead-free); Gold 0.38um min./Pure Tin 2um min. (Lead-free); Gold Flash (0.1um min.) over Palladium-Nickel 0.76um min./Pure Tin 2um (Lead-free) |
| Solder Area Finish | Matte pure Tin over Nickel |
| Packaging Options | Tape & Reel, Tubes |
| Product Specification | GS-12-547 |
| Test Report | DGS-29-010 |
Target Markets & Applications
- IP Phone
- Router
- Server
- Industrial and Instrumentation
- Office Equipment
- Point-Of-Sale Terminal
- Portable Industrial Terminal
- Test and Measurement
- Diagnostics System
2411201503_Amphenol-61082-044402LF_C561682.pdf
