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High density parallel connector Amphenol 61083-101402LF with scoop proof housing and PCB locator pegs

Manufacturer:
Amphenol
Description:
nan
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
System Fit Height:
-
Pitch:
0.8mm
Number Of Rows:
2
Number Of Pins:
100P
Contact Plating:
Mounting Type:
立贴
Mfr. Part #:
61083-101402LF
Package:
SMD,P=0.8mm
Model Number:
61083-101402LF
Introduction

Product Overview

The Amphenol BergStak 0.8mm is a flexible, high-density parallel board-to-board connector system designed for high-speed applications. It offers a comprehensive range of 16 PCB stack heights across 9 sizes, with up to 200 positions. This connector system supports speeds up to 12Gb/s and is compatible with PCIe Gen 2/3 and SAS 3.0 on selected stack heights. Its vertical-to-vertical mating configuration and 0.8mm double-row contact pitch conserve PCB space, making it ideal for applications requiring high density and reliable performance. The BergStak 0.8mm is suitable for various markets including IP Phones, Routers, Servers, Industrial and Instrumentation, Office Equipment, Point-Of-Sale Terminals, Portable Industrial Terminals, Test and Measurement, and Diagnostic Systems.

Product Attributes

  • Brand: Amphenol BergStak
  • Contact Pitch: 0.8mm
  • Mating Configuration: Vertical versus vertical
  • Material (Housing): Glass filled LCP, UL94V-0
  • Certifications: UL E66906, File no. LR46923
  • Compliance: RoHS compliant and lead-free
  • Features: Scoop-proof housings, PCB locator pegs option
  • Packaging Options: Tape & Reel, Tubes

Technical Specifications

Specification Details
Position Sizes 40 to 200 positions (in 20 position increments)
Stack Heights 5mm to 20mm (in 1mm increments)
High-Speed Support Up to 12Gb/s (guaranteed by housing and terminal profile)
Compatibility PCIe Gen 2/3 and SAS 3.0 on selected stack heights
Material (Contact Base Metal) Receptacle: Copper Alloy, High Spring; Plug: Brass
Contact Area Finish Options Gold or Gold flash over Palladium-nickel (GXT) over Nickel
Solder Area Finish Matte pure Tin over Nickel
Durability 100 mating cycles
Mating Force 0.9N max./contact
Unmating Force 0.1N min./contact
Insulation Resistance Initial: 1000M min.; After Test: 100M min.
Current Rating 0.8A/contact
Contact Resistance Initial: 30m max.; After Test: 50m max.
Voltage Rating 100VAC
Signal Integrity (Differential pairs) Impedance Range: 81 to 108 @ 50 ps edge (10-90%); Return Loss: < 10dB up to 5GHz; Insertion Loss: < 1.5dB up to 5GHz; NEXT: 4.0% for a 50 ps edge (10-90%); FEXT: 2.4% for a 50 ps edge (10-90%)
Temperature Range -40C to +125C
High Temperature Life 105C 5C for 1000 hours
Humidity 90-95% relative humidity for 96 hours
Mixed Flowing Gas Class 2a (30 GXT)
Product Specification GS-12-547
Test Report DGS-29-010

2412161826_Amphenol-61083-101402LF_C561686.pdf

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