Home > Products > Arrays, Edge Type, Mezzanine (Board to Board) >Free Hanging, Panel Mount > Wire to board and board to board connectivity Amphenol 71600-616LF shrouded headers with gold plating

Wire to board and board to board connectivity Amphenol 71600-616LF shrouded headers with gold plating

Manufacturer:
Amphenol
Description:
Connector Through Hole 2.54mm
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Free Hanging, Panel Mount
Specifications
Row Spacing:
2.54mm
Color:
灰色
Contact Plating:
Number Of Rows:
2
Pitch:
2.54mm
Mfr. Part #:
71600-616LF
Package:
Through Hole,P=2.54mm
Model Number:
71600-616LF
Introduction

Product Overview

The QUICKIE Shrouded Headers offer robust wire-to-board and board-to-board connectivity solutions. Designed for reliability and ease of use, these headers feature recessed pins to prevent damage during mating and end windows for latching with IDC receptacles. Available in various configurations including Through Mount Vertical, Right Angle, and SMT (Surface Mount) with Pin-in-Paste options, they cater to diverse application needs in communications and other industrial sectors. The SMT variants are optimized for automated assembly processes with tape-and-reel packaging.

Product Attributes

  • Brand: QUICKIE
  • Type: Shrouded Headers
  • Connectivity: Board-to-Board, Wire-to-Board
  • Certifications: RoHS compatible (Directive 2002/95/IEC), UL94V-0 Flammability rating
  • Housing Material: Glass filled thermoplastic polyester (Blue for Through Mount, Black for SMT, Grey for Eject Latch)
  • Pin Material: Phosphor-bronze
  • Plating: Gold/GXT over Nickel (specific thicknesses vary by product type)

Technical Specifications

Specification Details
Current Rating 3A continuous (Shrouded Headers), 1A continuous (IDC Receptacles, IDC PCB Connector)
Insulation Resistance 1 x 105 M min.
Dielectric Withstanding Voltage 500V RMS min. (Shrouded Headers), 1000V RMS min. (IDC Receptacles, IDC PCB Connector)
Operating Temperature Range -65C to +105C (Through Mount, Eject Latch, IDC Receptacle), -65C to +125C (SMT, IDC PCB Connector)
Pin Retention to Housing 20 N min.
Mating Cycles (IDC Receptacle) 100
Processing Compatibility Wave soldering, IR reflow soldering, Vapor-phase soldering (specifics vary by product type)
File Numbers E66906, LR46923
Product Specification (Shrouded Headers - Through Mount/Eject Latch) BUS-12-082
Product Specification (SMT, Pin-in-Paste) BUS-12-055
Product Specification (IDC Receptacle/PCB Connector) BUS-12-095
Plating (Through Mount Vertical/Right Angle Headers) 0.76m (30in.) gold/GXT on mating area, tin on solder side
Plating (SMT, Pin-in-Paste) Gold/GXT over 1.27m (50in.) nickel
Plating (Eject Latch Headers) Gold/GXT over 1.27m (50in.) nickel
Plating (IDC Receptacle) Gold/GXT over 1.27m (50in.) nickel
Plating (IDC PCB Connector) Tin over 1.27m (50in.) nickel
Latch Styles (Shrouded Headers) Standard Latch (Style 1), Low profile Latch (Style 2)
Latch Styles (IDC Receptacle) Standard (mates with IDC receptacle with strain relief), None (mates with shrouded eject latch header latch 2), Latching (mates with low profile headers)
Strain Relief Options (IDC Receptacle) Standard Strain Relief, Latching Strain Relief For Low Profile Header, Without Strain Relief
SMT Packaging Tape-and-Reel (for vertical), Tube (for right angle)
Through Mount Packaging Tubes

Note: Part numbers and specific dimensions are derived from base part numbers and are not listed exhaustively here.


2411111442_Amphenol-71600-616LF_C598941.pdf

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