Durable and Amphenol 76347-403LF connectors featuring dual beam contact design for industrial electronics
DUBOX Connectors
Product Overview
The DUBOX connector family offers a comprehensive range of board-to-board and wire-to-board solutions designed for reliability and performance. Featuring a dual-beam contact design for enhanced durability and low insertion force, these connectors are suitable for a wide array of industrial applications. Options include shunts, vertical receptacles (low profile and standard), horizontal receptacles (through-hole and surface mount), shrouded headers, and crimp-to-wire contacts and housings. They are designed for signal integrity, ease of testing, and robust mechanical performance across a wide temperature range.
Product Attributes
- Brand: DUBOX
- Certifications: RoHS compatible (European Union Directive 2002/95/IEC), UL94V-0 flammability rating
- Contact Material: Phosphor-bronze
- Housing Materials: High temperature thermoplastic, Glass filled thermoplastic polyester
- Plating Options: Gold or Tin over Nickel
Technical Specifications
| Specification | Details |
|---|---|
| Electrical Performance - Current Rating | 2.5A max. per contact (Shunts) 3A max. per individual contact (Receptacles, Headers, Crimp-to-Wire) 2A DC max. per contact for fully energized connector (Receptacles) |
| Electrical Performance - Insulation Resistance | 50,000M min. (Shunts) 1 x 105M min. (Receptacles, Headers, Crimp-to-Wire Housings) |
| Electrical Performance - Contact Resistance | 15M max. initial, 20M max. after environmental tests |
| Electrical Performance - Dielectric Withstanding Voltage | 800V (Shunts) 1000V RMS (Receptacles, Headers, Crimp-to-Wire Contacts) |
| Environmental - Operating Temperature Range | -65C to +125C |
| Mechanical Performance - Mating Cycles (Durability) | 50 (Gold), 25 (Tin) for Shunts 200 (Receptacles, Crimp-to-Wire Contacts) |
| Mechanical Performance - Insertion Force | 450gf max. per gold contact (Shunts) 500gf max. per tin-lead contact (Shunts) 1.50 N (150gf) max. per gold contact (Vertical Receptacles, Low Profile Vertical Receptacles, Horizontal Receptacles) 1.3 N per gold finish contact (Crimp-to-Wire Contacts) |
| Mechanical Performance - Withdrawal Force | 30gf min. per gold contact (Shunts) 30gf min. per tin-lead contact (Shunts) 0.30 N (30gf) min. per gold contact (Vertical Receptacles, Low Profile Vertical Receptacles, Horizontal Receptacles) 0.3 N min. per gold finish contact (Crimp-to-Wire Contacts) |
| Mechanical Performance - Insertion Depth | 4.85 mm (.191in.) min. (Shunts) Top entry: 3.6mm min. to 6.81mm max. (Vertical Receptacles) Bottom entry: 7mm min. plus board thickness (Vertical Receptacles) Top entry: 3.6mm min. to 6.7mm max. (Low Profile Vertical Receptacles) Bottom entry: 6mm min. plus board thickness (Low Profile Vertical Receptacles) 3.6mm min. to 7.50mm max. (Horizontal Receptacles) Discrete wire: 3.6mm min. to 5.6mm max. (Crimp-to-Wire Contacts) Crimp-to-wire housing: 5.1mm min. to 6.2mm max. (Crimp-to-Wire Contacts) |
| Specifications - File Numbers | E66906, LR46923 |
| Plating Details | 0.76m (30in.) gold on mating area, tin on solder side Gold or tin over 1.27m (50in.) nickel |
| Packaging | Plastic bags, Plastic boxes or tubes, Reels, Bulk |
| Processing Information | Compatible with wave soldering, vapor-phase, and IR reflow soldering processes |
| Typical Applications | General industrial, board-to-board, wire-to-board connections |
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