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1.25mm Pitch Wire to Board Connector Amphenol 10114828-10103LF with Halogen Free PCB Header Material

Manufacturer:
Amphenol
Description:
Connector Header 1.25mm Pitch
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Flame Retardant Rating:
UL94V-0
Pins Structure:
1x3P
Contact Plating:
Contact Material:
铜合金;LCP
Pitch:
1.25mm
Number Of PINs Per Row:
3
Number Of Rows:
1
Operating Temperature:
-40℃~+105℃
Mounting Type:
立贴
Mfr. Part #:
10114828-10103LF
Package:
Through Hole,P=1.25mm
Model Number:
10114828-10103LF
Introduction

Product Overview

The Amphenol Basics Minitek 1.25mm wire-to-board connector system is a high-quality, compact solution designed for a wide range of applications across Industrial, Automotive, and Consumer markets. This comprehensive system includes terminals, crimp housings, and PCB headers available in straight and right-angle, surface mount, and through-hole configurations. It supports 2 to 15 circuits in a single row and is engineered to prevent accidental mismating with fully polarized housings and a crimp housing with a friction feature for enhanced retention. The system conforms to EU Industry Safety Standards, with PCB header material meeting halogen-free requirements and operating within a temperature range of -40C to +105C. It is suitable for applications requiring space savings due to its 1.25mm pitch and accommodates a wire range up to 32AWG-28AWG.

Product Attributes

  • Brand: Amphenol Basics Minitek
  • Pitch: 1.25mm
  • Circuit Range: 2 to 15 circuits
  • Housings: Fully polarized with friction feature
  • PCB Header Material: High temperature thermoplastic, UL94V-0, Halogen-free resin
  • Certifications: EU Industry Safety Standard, UL approval, RoHS compliant (EU Directive 2002/95/EC), Glow Wire Test (IEC 60695-2)
  • Packaging: Tape and Reel (PCB Header), Bag (Crimping Housing), Reel (Terminal)
  • Lead-free: Yes

Technical Specifications

Specification Details
Contact Material Copper Alloy
Contact Plating Options Matte Tin, Gold flash, 15in. Gold, 30in. Gold over Nickel
Housing Material Thermoplastic high temperature, UL94V-0
Metal Hold Down Material Copper Alloy
Metal Hold Down Plating Matt Tin
Contact Resistance 20m max.
Insulation Resistance 100M min.
Voltage Rating 125VAC, VDC
Current Rating 1A (0.8A - 32AWG)
Dielectric Withstand Voltage 500VAC/minute
Mating & Un-mating Force Conforms to EIA-364-13
Contact Retention Force 0.5Kgf min.
Hold Down/Housing Retention Force 1.0Kgf min.
Wire Retention Force 0.5Kgf min.
Terminal/Housing Retention Force 0.5Kgf min.
Vibration 1s max., EIA-364-28 Condition I
Shock 1s max., EIA-364-27A
Durability 30 cycles
Resistance to Re-flow Soldering Heat Pre-heat: 150C to 180C, 60-90s; Heat: 230C min., 40s min.; Peak Temp: 260C max., 10s max.
Resistance to Hand Soldering Heat Soldering iron: 35010C, Duration: 3S-4S min.
Thermal Shock Conforms to EIA-364-32A
Humidity (temperature cycling) Conforms to EIA-361-31A
Temperature Life (heat aging) Conforms to EIA-361-17A, 105C for 96 hours
Salt Spray Conforms to EIA-364-26B
Solderability Min. 95% solder coverage on solderable area
Operating Temperature Range -40C to +105C
Product Specifications Document GS-12-675
Packaging Specifications Documents GS-14-1592; GS-14-1593

Target Markets/Applications

  • Car Audio Industry
  • Control Instrumentation/Metering
  • Office Equipment
  • Small Motor/Robot Control
  • Security Alarm Systems
  • Vending POS Machine

2410311247_Amphenol-10114828-10103LF_C5407014.pdf

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