interconnect solutions Amphenol 20021321-00016C4LF 127 millimeter modular system with gold plated copper alloy pins
Product Overview
The FCI MINITEK 127 is a 1.27 mm (.050) modular system designed for reliable interconnect solutions. This system comprises a range of headers and receptacles, including IDC (Insulation Displacement Connector) types, suitable for board-to-board, flat cable, and PCB applications. Engineered with high-temperature thermoplastic housing and copper alloy pins with gold plating, MINITEK 127 connectors offer robust electrical and mechanical performance, making them ideal for telecommunication infrastructures, consumer electronics, and industrial applications.
Product Attributes
- Brand: FCI
- Product Line: MINITEK 127
- Pitch: 1.27 mm (.050)
- Housing Material: High-temperature, black thermoplastic
- Flammability Rating: UL 94 V-0
- Pin Material: Copper Alloy
- Plating: Gold over Nickel
- RoHS Compatibility: Compliant with European Union Directive 2002/95/IEC
Technical Specifications
| Specification | Details |
|---|---|
| Current Rating | 1 A continuous |
| Insulation Resistance | 1 x 102 M min. |
| Contact Resistance | 30 m max. |
| Dielectric Withstanding Voltage | 500 V |
| Voltage Rating | 125 V |
| Mating Cycles (Durability) | 100 |
| Operating Temperature Range | -40C to +85C |
| Processing Temperature Resistance | Withstands 260C peak temperature for 10 seconds in a wave solder application |
| Packaging | Standard: Tubes. Optional: Tubes with pick-up cap, Tape and reel with pick-up cap (availability may vary) |
| Plating Options | Gold flash, 0.25m (10) gold on contact, 0.76m (30) gold on contact, Gold over 1.0 m (40) nickel, Gold over 1.27 m (50) nickel |
| Product Drawing Reference | Varies by model (e.g., 20021111, 20021311) |
| Product Specification Reference | GS-12-629 |
| Packaging Specification Reference | GS-14-1420 |
| Part Numbering System Example | 20021221 = shrouded SMT vertical header |
| Available Product Types | IDC Receptacle, IDC Header (Through Hole, SMT, Right Angle), IDC Eject Header (Through Hole, Right Angle, SMT), Vertical Through Hole Headers, Right Angle Through Hole Headers, Vertical SMT Headers, Right Angle SMT Headers, Stacking Headers, Vertical Through Hole Shrouded Headers, Right Angle Through Hole Shrouded Headers, Vertical SMT Shrouded Headers, Vertical Through Hole Receptacles, Vertical SMT Receptacles, Vertical SMT Bottom Entry Receptacles |
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