Lead Free Connector Amphenol 10119313-301TLF with Thermoplastic Housing and Gold Plated Contact Area
Product Overview
This product features a thermoplastic housing, UL 94V-0 rated and black in color. It is designed for SMT or DIP applications, with specific plating options for the contact and soldering areas. The housing is engineered to withstand high temperatures during reflow processes and meets European Union directives and other country regulations. Refer to GS-22-008 for detailed regulatory information.
Product Attributes
- Housing Material: Thermoplastic, UL 94V-0 rated
- Housing Color: Black
- Plating in Contact Area: 30u" MIN. Au (Gold)
- Plating in Soldering Area: 100u" MIN. Pure Matte Tin
- Shell Material: Copper Alloy
- Contact Material: Copper Alloy
- Underplating: 50u" MIN. Nickel, over all
- Lead-Free Plating: Yes (LF option)
- Packaging Options: Tape and Reel (R), Tape and Reel with Cap (C), Tray (T)
- Regulatory Compliance: Meets European Union directives and other country regulations (as described in GS-22-008)
Technical Specifications
| Specification | Details |
|---|---|
| Housing Material | Thermoplastic, UL 94V-0 rated |
| Contact Plating | 30u" MIN. Gold plating on contact area. Nickel 80u" MIN. plated over all. |
| Soldering Area Plating | 100u" MIN. Pure Matte Tin plated in soldering area. |
| Shell Material | Copper Alloy |
| Housing Temperature Resistance | Withstands exposure to 260 degrees C peak temperature for 10 seconds in an IR reflow application. |
| Product Specification Document | GS-12-174 |
| Packaging Specification Document | GS-14-873 |
| SMT Type | See Page 2 |
| DIP Type | See Page 1 |
| Lead Free Option | LF |
2411220707_Amphenol-10119313-301TLF_C598530.pdf