Compact board to board connector ATOM BTB050080-M1D08200 side inserted smd type with 0.5mm 0.8mm pitch
Manufacturer:
ATOM
Description:
SMD,P=0.5mm Arrays, Edge Type, Mezzanine (Board to Board) RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Arrays, Edge Type, Mezzanine (Board to Board)
Specifications
Mfr. Part #:
BTB050080-M1D08200
Package:
SMD,P=0.5mm
Model Number:
BTB050080-M1D08200
Introduction
Product Overview
This specification covers the performance, tests, and quality requirements for the 0.5mm/0.8mm Pitch Side-inserted BOARD to BOARD SMD Type Connector. Designed for reliable electrical connections, these connectors are suitable for various applications requiring compact and robust board-to-board interfacing.
Product Attributes
- Brand: ATOM
- Product Series: BTB
- Type: Board to Board Connector, SMD Type, Side-inserted
- Material (Housing): Thermoplastic, UL94V-0
- Material (Terminal): Copper alloy, Gold plated under-plated Ni overall
- Color (Housing): Black (implied by sample dimension testing report)
- Certifications: RoHS compliant (implied by material reports)
Technical Specifications
| Specification | Details | Test Procedure/Conditions |
|---|---|---|
| Pitch | 0.5mm / 0.8mm | - |
| Product Model (Example) | BTB0.5mm 2*35P (Double Row, 35 Positions per Row) | - |
| Housing Height (Example) | 4.0mm | - |
| Voltage Rating | 60V DC | - |
| Current Rating | 0.5A Max. (Each Pin) | - |
| Operating Temperature | -40 to +105 (Including terminal temperature rise) | - |
| Operating Humidity Range | 93% Max. Relative humidity | - |
| Storage Temperature Range | 208 | - |
| Storage Humidity Range | 60% Max. Relative humidity | - |
| Contact Resistance | 60m (Initial) 90m (After Durability, Vibration, Heat Resistance, Cold Resistance, Humidity) | Mate: Dry circuit, 20mV Max., 100mA Max. (EIA-364-23) |
| Insulation Resistance | 800M (Initial) 500M (After Humidity) | Unmated: 500V DC between adjacent terminals or terminal to ground (EIA-364-21) |
| Dielectric Withstanding Voltage | No Breakdown (Current leakage: 1 mA max.) | Unmated: 500V AC for 1 minute between adjacent circuits (EIA-364-20) |
| Contact Retention Force | 0.03Kgf/Pin {0.294N} | Mate: Applied at 253mm/minute (EIA-364-13) |
| Insertion Force | 0.08KgfxN Max. (N=Pins) | Mate: Soldered on board, inserted/separated at 253mm/min (EIA-364-13) |
| Durability | 30 cycles | Mate: Inserted/separated at 253mm/min (EIA-364-09) |
| Vibration | Contact Resistance 90m | Mate connectors: DC 1mA, Amplitude 1.5mm P-P, Frequency 10~55~10 Hz in 1 min, 2 hours per axis (X, Y, Z) (EIA-364-28 Condition I) |
| Temperature Rising | Max. 30 | Under rated current (EIA-364-70 METHOD 2) |
| Heat Resistance | Contact Resistance 90m | Mate: 1052 for 96 hours, then conditioned at room temperature for 1-2 hours |
| Cold Resistance | Contact Resistance 90m | Mate: -402 for 96 hours, then conditioned at room temperature for 1-2 hours |
| Humidity Resistance | Contact Resistance 90m Dielectric Strength: No Breakdown Insulation Resistance 500M | Mate: 402, 90~95% RH for 96 hours, then conditioned at room temperature for 1-2 hours |
| Salt Spray | Appearance: No damage | 352, 51% salt spray: Sn plated area (12h), Au plated area 1-3u" (24h), Au plated area 5u" (48h). Clean with water and dry. |
| Solderability (Solder Wetting) | 95% of immersed area must show no voids, pinholes | 2455 solder bath, 30.5 seconds immersion depth 0.1mm from housing (EIA-364-52) |
| Resistance to Soldering Heat | Appearance: No damage/deformation after 2 reflows | Reflow profile: Peak 2605, Pre-heat 150~180, 40-60 sec (220 MIN.), 90-120 sec (above 220) |
2507301831_ATOM-BTB050080-M1D08200_C7467065.pdf
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