Solderless Bel Fuse 14160BL Z Axis Compression Mount Interconnect for Flex Circuit to PCB Connections
Product Overview
The CIN::APSE High-Speed Interconnect Technology is a solderless, Z-axis compression mount interconnect system designed for high signal speed capabilities, enabling frequencies greater than 20 GHz. It offers solutions to issues associated with traditional through-hole and surface mount technologies, facilitating system upgrades and maintenance. Applications include Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB, and parallel PCB to PCB interconnections. The system provides low profile capabilities with signal path lengths as short as 0.8 mm and contact centerline spacing of 1mm or greater, ensuring excellent reliability in commercial, military, and aerospace applications, while potentially lowering installed and system maintenance costs.
Product Attributes
- Brand: CIN::APSE
- Contact Material: Molybdenum
- Contact Plating: Gold
- Plunger Material: Copper alloy
- Plunger Plating: Gold
- Insulator Material: Liquid crystal polymer
- Packaging Tray Material: Anti-static ABS
- Certifications: Bellcore TR-NWT-001217: Passed
Technical Specifications
| Specification | Value |
|---|---|
| Catalog Number | C-865 |
| Button-Only Configuration Diameter | 0.020" (0.5 mm) |
| DC Resistance | 15m (average) |
| Inductance | Less than 1 nH |
| Current-Carrying Capability | Up to 3 Amps |
| Insulation Resistance | 25,000 Meg @ 500 VDC |
| Dielectric Withstanding Voltage | 900 VAC at sea level |
| Temperature Life Testing | 1000 Hours @ 200C |
| Thermal Shock | 2,000 Cycles @ 20C to 110C |
| Humidity | 5,000 Hours @ 30C to 80C, 80% RH |
| Salt Spray | 96 Hours |
| Low Temperature Operation | Operates in liquid nitrogen (77K) |
| Durability | 25,000 Z-axis actuations (CIN::APSE contact only) |
| Shock | 100 Gs; 6 milliseconds, no discontinuity greater than 2 nanoseconds |
| Vibration | 20 Gs; 10-20,000 Hz; no discontinuity greater than 2 nanoseconds |
| Signal Speed Capability | Frequencies greater than 20 GHz |
| Interconnect System | Z-Axis, solderless, compression mount |
| Minimum Compressed Signal Path Length | 0.8 mm |
| Contact Centerline Spacing | 1mm or greater |
| CIN::APSE Contact Diameters | 0.020" and 0.040" |
| CIN::APSE Contact Form | Randomly wound molybdenum wire, formed into a cylindrical shape |
| CIN::APSE Mechanical - Form Factor | 0.020" diameter by 0.32" min. high |
| CIN::APSE Mechanical - Compression Force | Approx. 2.5 oz. min. per contact |
| CIN::APSE Mechanical - Contact Points | Multiple beam structures, several points of contact per button |
| CIN::APSE Electrical - Signal Path | Short |
| CIN::APSE Electrical - Inductance/Resistance | Very low |
| CIN::APSE Electrical - Signal Integrity Test Range | GHz range |
| Basic Button Contact Protrusion | Typically 0.003" from top and bottom of insulator |
| Patented Cavity Design | hourglass design |
2411061525_Bel-Fuse-14160BL_C21975288.pdf
