High Frequency Interconnect Bel Fuse 14-160-BR with Copper Alloy Plungers and Molybdenum Contacts
Product Overview
The CIN::APSE High-Speed Interconnect Technology offers a solderless, Z-Axis compression mount interconnect system designed for high signal speed capabilities, enabling frequencies greater than 20 GHz. It provides solutions for common interconnect challenges, supports system upgrades and maintenance, and is available in custom configurations with I/O counts from 1 to over 5,000. Its low-profile design and short signal path contribute to lower installed and system maintenance costs, making it suitable for commercial, military, and aerospace applications.
Product Attributes
- Brand: CIN::APSE
- Contact Material: Molybdenum
- Contact Plating: Gold
- Plunger Material: Copper alloy
- Plunger Plating: Gold
- Insulator Material: Liquid crystal polymer
- Packaging Tray Material: Anti-static ABS
- Certifications: Bellcore TR-NWT-001217 Passed
Technical Specifications
| Specification | Details |
|---|---|
| Catalog Number: | C-865 |
| Configuration: | Button-Only (0.020" / 0.5 mm Diameter) |
| DC Resistance: | 15 m (average) |
| Inductance: | Less than 1 nH |
| Current-Carrying Capability: | Up to 3 Amps |
| Insulation Resistance: | 25,000 Meg @ 500 VDC |
| Dielectric Withstanding Voltage: | 900 VAC at sea level |
| Temperature Life Testing: | 1000 Hours @ 200C |
| Thermal Shock: | 2,000 Cycles @ 20C to 110C |
| Humidity: | 5,000 Hours @ 30C to 80C, 80% RH |
| Salt Spray: | 96 Hours |
| Low Temperature Operation: | Operates in liquid nitrogen (77K) |
| Durability: | 25,000 Z-axis actuations (CIN::APSE contact only) |
| Shock: | 100 Gs; 6 milliseconds, no discontinuity greater than 2 nanoseconds |
| Vibration: | 20 Gs; 10-20,000 Hz; no discontinuity greater than 2 nanoseconds |
| Signal Speed Capability: | Frequencies greater than 20 GHz |
| Mounting System: | Z-Axis, solderless, compression mount |
| Applications: | Production Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB, parallel PCB to PCB interconnections |
| Profile: | Low profile capabilities with compressed signal path length as short as 0.8 mm |
| Contact Centerline Spacing: | 1mm or greater |
| Contact Diameter: | 0.020" (0.5 mm) and 0.040" (1.0 mm) |
| Contact Form: | Randomly wound molybdenum wire, formed into cylindrical shape |
| Mechanical Features: | Small form factor, low compression force (approx. 2.5 oz. min. per contact), multiple beam structures, several points of contact per button, extremely lightweight, natural wiping action |
| Electrical Features: | Short signal path, very low inductance and resistance, signal integrity tested in GHz range |
2410311017_Bel-Fuse-14-160-BR_C21194304.pdf