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High Frequency Interconnect Bel Fuse 14-160-BR with Copper Alloy Plungers and Molybdenum Contacts

Manufacturer:
Bel Fuse
Description:
Circular Connector Accessories RoHS
Category:
Circular Connector Accessories/Circular Connector Accessories
Specifications
Mfr. Part #:
14-160-BR
Model Number:
14-160-BR
Introduction

Product Overview

The CIN::APSE High-Speed Interconnect Technology offers a solderless, Z-Axis compression mount interconnect system designed for high signal speed capabilities, enabling frequencies greater than 20 GHz. It provides solutions for common interconnect challenges, supports system upgrades and maintenance, and is available in custom configurations with I/O counts from 1 to over 5,000. Its low-profile design and short signal path contribute to lower installed and system maintenance costs, making it suitable for commercial, military, and aerospace applications.

Product Attributes

  • Brand: CIN::APSE
  • Contact Material: Molybdenum
  • Contact Plating: Gold
  • Plunger Material: Copper alloy
  • Plunger Plating: Gold
  • Insulator Material: Liquid crystal polymer
  • Packaging Tray Material: Anti-static ABS
  • Certifications: Bellcore TR-NWT-001217 Passed

Technical Specifications

Specification Details
Catalog Number: C-865
Configuration: Button-Only (0.020" / 0.5 mm Diameter)
DC Resistance: 15 m (average)
Inductance: Less than 1 nH
Current-Carrying Capability: Up to 3 Amps
Insulation Resistance: 25,000 Meg @ 500 VDC
Dielectric Withstanding Voltage: 900 VAC at sea level
Temperature Life Testing: 1000 Hours @ 200C
Thermal Shock: 2,000 Cycles @ 20C to 110C
Humidity: 5,000 Hours @ 30C to 80C, 80% RH
Salt Spray: 96 Hours
Low Temperature Operation: Operates in liquid nitrogen (77K)
Durability: 25,000 Z-axis actuations (CIN::APSE contact only)
Shock: 100 Gs; 6 milliseconds, no discontinuity greater than 2 nanoseconds
Vibration: 20 Gs; 10-20,000 Hz; no discontinuity greater than 2 nanoseconds
Signal Speed Capability: Frequencies greater than 20 GHz
Mounting System: Z-Axis, solderless, compression mount
Applications: Production Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB, parallel PCB to PCB interconnections
Profile: Low profile capabilities with compressed signal path length as short as 0.8 mm
Contact Centerline Spacing: 1mm or greater
Contact Diameter: 0.020" (0.5 mm) and 0.040" (1.0 mm)
Contact Form: Randomly wound molybdenum wire, formed into cylindrical shape
Mechanical Features: Small form factor, low compression force (approx. 2.5 oz. min. per contact), multiple beam structures, several points of contact per button, extremely lightweight, natural wiping action
Electrical Features: Short signal path, very low inductance and resistance, signal integrity tested in GHz range

2410311017_Bel-Fuse-14-160-BR_C21194304.pdf

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