wire to board connector BOOMELE Boom Precision Elec PHD-2 6AW with 2.0 millimeter pitch and lead free material
Manufacturer:
BOOMELE(Boom Precision Elec)
Description:
Connector Header 12 position 2mm Pitch Right Angle
Category:
Free Hanging, Panel Mount/Headers, Male Pins
Specifications
Y-Width Of Bottom Edge On Board:
9.5mm
Reference Series:
PHD
Pins Structure:
2x6P
Contact Plating:
锡
Contact Material:
黄铜;PA
Operating Temperature:
-25℃~+85℃
Flame Retardant Rating:
UL94V-0
Supplementary Features:
-
Pitch:
2mm
Voltage Rating (Max):
250V
Number Of PINs Per Row:
6
Number Of Rows:
2
X-Length Of Bottom Edge On Board (Spacing Line):
13.9mm
Z-Height Of The Board:
5mm
Row Spacing:
2mm
Mounting Type:
弯插
Mfr. Part #:
PHD-2*6AW
Package:
Through Hole,Right Angle,P=2mm
Model Number:
PHD-2*6AW
Introduction
Product Overview
The PH-D SERIES 2.0mm Pitch Wire to Board Connector series offers reliable connectivity for various applications. This specification covers wire to board connectors, including terminals, housings, and wafer assemblies. Designed for use with wire gauges AWG #24-30, these connectors operate within a rated voltage of 250V and a rated current of up to 2.0A. They are suitable for ambient temperatures ranging from -25 to +85 and are manufactured with lead-free materials.
Product Attributes
- Brand: BOOMELE
- Series: PH-D SERIES
- Pitch: 2.0mm
- Type: Wire to Board Connector
- Material: Lead-Free
- Applicable Wire Gauge: AWG #24-30
Technical Specifications
| Category | Item | Specification | Test Condition / Standard |
|---|---|---|---|
| Ratings | Rated Voltage (MAX.) | 250V | |
| Rated Current (MAX.) | 2.0 A (AWG #24), 2.0 A (AWG #32) | ||
| Ambient Temperature Range | -25+85 | ||
| Maximum Insulation O.D. | 1.0mm | ||
| Electrical Performance | Contact Resistance (Mated) | < 20 milliohm MAX. | Mate connectors, measure by dry circuit, 10mV MAX., 20mA. (JIS C5402 5.4) |
| Insulation Resistance | 100 Megohm MIN. | Apply 800V DC between adjacent terminals or terminal and ground. (JIS C5402 5.2/MIL-STD-202 Method 302) | |
| Dielectric Strength | No Breakdown | Apply 800V AC(rms) between adjacent terminals or terminal and ground for 1 minute. (JIS C5402 5.1/MIL-STD-202 Method 301) | |
| Contact Resistance on Crimped Portion | < 5 milliohm MAX. | Crimp the applicable wire to the terminal, and measure contact resistance by dry circuit, 10mV MAX., 20mA. | |
| Mechanical Performance | Insertion and Withdrawal Force (Connector) | Refer to paragraph 7 | Insert and withdraw connectors at the speed rate of 25+ 3mm/minute. |
| Crimping Strength | AWG #24: 9.8 N (1.0kgf) MIN. AWG #32: 4.9 N (0.5kgf) MIN. | Fix the crimped terminal, apply axial pull out force on the wire at the speed rate of 25+ 3mm/minute. | |
| Terminal Insertion Force (into Housing) | 4.9 N (0.5kgf) MAX. | Insert the crimped terminal into the housing. | |
| Terminal/Housing Retention Force | 4.9 N (0.5kgf) MIN. | Apply axial pull out force to the terminal assembled in the housing at the speed rate of 25 +3mm/minute. | |
| Pin Retention Force | 4.9 N (0.5kgf) MIN. | Apply axial push force at the speed rate of 25+ 3mm/minute. | |
| Environmental & Durability Performance | Mechanical Life | < 40 milliohm MAX. (Contact Resistance) | Mated up to 30 cycles repeatedly by the rate of 10 cycles per minute. |
| Temperature Rise | 30 MAX. | Carrying rated current load. (UL 498) | |
| Vibration | No Damage, < 40 milliohm MAX. (Contact Resistance), < 1.0 microsecond MAX. (Discontinuity) | Amplitude 1.5mm P-P, 10-55-10 Hz in 1 minute, 2 hours in each x.y.z. axes. (MIL-STD-202 Method 201) | |
| Shock | No Damage, < 40 milliohm MAX. (Contact Resistance), < 1.0 microsecond MAX. (Discontinuity) | 490m/s2 {50G}, 3 strokes in each X.Y.Z. axes. (MIL-STD-202 Method 213) | |
| Heat Resistance | No Damage, < 40 milliohm MAX. (Contact Resistance) | Placed in an environment of 83 to 87 for 96 hours. (JIS C60068-2-2/MIL-STD-202 Method 108) | |
| Cold Resistance | No Damage, < 40 milliohm MAX. (Contact Resistance) | Placed in an environment of -37 to -43 for 96 hours. (JIS C60068-2-1) | |
| Humidity | No Damage, < 40 milliohm MAX. (Contact Resistance), 10 Megohm MIN. (Insulation Resistance), Must meet 4-1-3 (Dielectric Strength) | Temperature 58-62, Relative Humidity 90-95%, Duration: 96 hours. (JIS C60068-2-3/MIL-STD-202 Method 103) | |
| Temperature Cycling | No Damage, < 40 milliohm MAX. (Contact Resistance) | 5 cycles of: a) 55 for 30 minutes, b) +105 for 30 minutes. (JIS C0025) | |
| Salt Spray | No Damage, < 40 milliohm MAX. (Contact Resistance) | 48 hours exposure to a salt spray from a 51% solution at 352. (JIS C5028/MIL-STD-202 Method 101) | |
| SO2 Gas | No Damage, < 40 milliohm MAX. (Contact Resistance) | 24 hours expose to 505ppm SO2 gas at 402. | |
| NH3 Gas | No Damage, < 40 milliohm MAX. (Contact Resistance) | 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution. | |
| Soldering Performance | Solderability | 95% of immersed area must show no voids, pin holes. | Soldering Time 2-3 sec. Solder Temperature 2455, 0.5mm from terminal tip and fitting nail tip. |
| Resistance To Solder-Ing Heat | No Damage | Soldering iron method: Soldering time: 31 sec. Solder temperature 370-400, 0.5mm from terminal tip and fitting nail tip. | |
| Reflow Condition | Infrared Reflow | Peak Temp: 250 MAX. Time (230): 30 SEC. MIN. Time (Total): 120 SEC. (Pre-heat: 150200) | Note: Please check the reflow soldering condition by your own devices beforehand. |
| Product Models / Parts | Product Name | Terminal, Housing, Wafer Assembly | |
| Part Number | PH-D-PT (Terminal) PH-D-2*Y/HK (Housing) PH-D-2*A (Wafer Assembly R/A) | ||
| Packaging | Plastic Package (Wafer Assembly) | ||
| Reference | Refer to the drawing |
Note on Insertion/Withdrawal Force (Paragraph 7): The insertion and withdrawal force values for 'housing and wafer' are measured after the terminal is crimped and assembled with the housing and wafer.
2410121243_BOOMELE-Boom-Precision-Elec-PHD-2-6AW_C71269.pdf
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