Solderless Z Axis Compression Mount Technology CINCH 97-WR-S50 for Flex Circuit to PCB Connections
Manufacturer:
CINCH
Description:
Circular Connector Accessories RoHS
Category:
Circular Connector Accessories/Circular Connector Accessories
Specifications
Mfr. Part #:
97-WR-S50
Model Number:
97-WR-S50
Introduction
Product Overview
The CIN::APSE High Speed Interconnect Technology offers a solderless, Z-axis compression mount interconnect system designed for high signal speed capability, enabling frequencies greater than 20 GHz. It provides solutions for Land Grid Array (LGA) integrated circuit sockets, flex circuit to PCB, and parallel PCB to PCB interconnections, offering a low-profile design with signal path lengths as short as 0.8 mm. This technology is suitable for commercial, military, and aerospace applications, contributing to lower installed and system maintenance costs.
Product Attributes
- Brand: CIN::APSE
- Contact Material: Molybdenum
- Contact Plating: Gold
- Plunger Material: Copper alloy
- Plunger Plating: Gold
- Insulator Material: Liquid crystal polymer
- Packaging Tray Material: Anti-static ABS
- Certifications: Bellcore TR-NWT-001217 (Passed)
Technical Specifications
| Specification | Value |
|---|---|
| Catalog Number | C-865 |
| Diameter | 0.020" (0.5 mm) |
| DC Resistance | 15m (average) |
| Inductance | Less than 1 nH |
| Current-Carrying Capability | Up to 3 Amps |
| Insulation Resistance | 25,000 Meg @ 500 VDC |
| Dielectric Withstanding Voltage | 900 VAC at sea level |
| Temperature Life Testing | 1000 Hours @ 200C |
| Thermal Shock | 2,000 Cycles @ 20C to 110C |
| Humidity | 5,000 Hours @ 30C to 80C, 80% RH |
| Salt Spray | 96 Hours |
| Low Temperature Operation | Operates in liquid nitrogen (77K) |
| Durability | 25,000 Z-axis actuations (CIN::APSE contact only) |
| Shock | 100 Gs; 6 milliseconds, no discontinuity greater than 2 nanoseconds |
| Vibration | 20 Gs; 10-20,000 Hz; no discontinuity greater than 2 nanoseconds |
| Signal Speed Capability | Frequencies greater than 20 GHz |
| Mounting System | Z-Axis, solderless, compression mount |
| Contact Centerline Spacing | 1mm or greater |
| Low Profile Capability | Signal path length as short as 0.8 mm |
| Custom I/O Configurations | Available from 1 to over 5,000 |
| Mechanical Features | Small form factor, low compression force (approx. 2.5 oz. min. per contact), multiple beam structures, several points of contact per button, extremely lightweight, natural wiping action |
| Electrical Features | Short signal path, very low inductance and resistance, signal integrity tested in GHz range |
| Typical Applications | LGA package I/O to PC board (IC packages, multi-chip modules), PC board to PC board (parallel processors, enhancement/mezzanine cards), Flex circuit to PC board (rigid flex, harnessing), Flex circuit to ceramic (chip to harness) |
2410301826_CINCH-97-WR-S50_C17331564.pdf
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