White LCP PA66 base electrical wafer Hanbo Electronic WAFER HY200JK 2A with brass contacts rated 250V 2A
Manufacturer:
Hanbo Electronic
Description:
Connector Housing 2 Position 2mm Pitch Single Row HY Series PA66 -25℃~+85℃
Category:
Free Hanging, Panel Mount/Rectangular Connector Housings
Specifications
Pitch:
2mm
Flame Retardant Rating:
UL94V-0
Colour:
白色
Number Of Rows:
1
Reference Series:
HY
Operating Temperature:
-25℃~+85℃
Plastic Material:
PA66
Number Of PINs Per Row:
2
With Locker:
带锁扣
Mfr. Part #:
WAFER-HY200JK-2A
Package:
P=2mm
Model Number:
WAFER-HY200JK-2A
Introduction
Product Overview
This product features brass contacts plated with nickel and tin, housed in a white LCP/PA66 (UL94V-0) base. It is designed for electrical applications with a rated voltage of 250V AC/DC and a rated current of 2.0A AC/DC. Key technical specifications include a contact resistance of 10m, insulation resistance of 1000M, and a dielectric strength of 1000V AC/Minute. The operating temperature range is from -25C to +85C. The product also meets environmental requirements regarding hazardous substances. It is suitable for PCB mounting as indicated by the suggested PCB layout.
Product Attributes
- Base/Wafer Material: LCP/PA66 (UL94V-0)
- Contact Material: Brass
- Plating (Contacts): Nickel undercoat, Tin plating (30"MIN)
- Re-plating (Contacts): Tin plating (80"MIN)
- Color: White
Technical Specifications
| Specification | Value |
|---|---|
| Contact Resistance | 10m |
| Insulation Resistance | 1000M |
| Rated Voltage | 250V AC DC |
| Rated Current | 2.0A AC DC |
| Withstand Voltage | 1000V AC/Minute |
| Operating Temperature | -25C to +85C |
| Solderability Test (Immersion Area) | 95% |
| Solderability Test (Temperature) | 220C +5C / -0C |
| Solderability Test (Time) | 2.5 0.5 seconds |
| Hazardous Substances | Compliant with environmental requirements (e.g., Lead, Cadmium) |
| Dimensions (Overall Height) | 8 0.2 mm |
| Dimensions (Wafer Length) | 5.10 0.2 mm |
| Dimensions (Wafer Width) | 4.00 +0.15 / -0.15 mm |
| Dimensions (Contact Diameter) | 0.50 0.05 mm |
| Dimensions (Pitch) | 2.00 0.10 mm |
| Dimensions (PCB Layout Hole Diameter) | 0.7 0.10 mm |
| Dimensions (PCB Layout Pad Diameter) | 0.7 0.10 mm |
| Dimensions (PCB Layout Pad Spacing) | 2.00 0.10 mm |
| Dimensions (PCB Layout Offset) | A 0.20 mm |
| Dimensions (PCB Layout Offset) | B 0.2 mm |
| Dimensions (PCB Layout Offset) | C 0.15 mm |
| Dimensions (PCB Layout Offset) | (B-1.1) +0.15 / -0.15 mm |
| Dimensions (PCB Layout Offset) | 3.4 0.3 mm |
2410121223_Hanbo-Electronic-WAFER-HY200JK-2A_C22374505.pdf
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