Durable connector HanElectricity NANO-1151 featuring gold plating and copper alloy terminals for electrical performance
Product Overview
The NANO-1151 is a high-temperature thermoplastic connector designed for reliable electrical connections. It features a copper alloy terminal and stainless steel shell, with gold plating for enhanced conductivity and durability. This connector is suitable for applications requiring up to 10,000 mating cycles and can withstand reflow soldering temperatures up to 260C. It is designed to accommodate Micro SIM and Nano SIM card formats.
Product Attributes
- Brand: (HanElectricity Co.,LTD)
- Model Name: NANO-1151
- Insulator Material: High Temperature Thermoplastic, UL94V-0
- Insulator Color: Black
- Terminal Material: Copper Alloy
- Shell Material: Stainless Steel
- Contact Plating: 50u'' Ni Overall, 1u" Au Contact
- Shell Plating: 50u'' Ni Overall, 1u" Au PAD
Technical Specifications
| Specification | Value |
|---|---|
| Current Rating | 0.5mA AC/DC max. |
| Voltage Rating | 125V AC/DC |
| Ambient Temperature Range | -20C to +60C |
| Storage Temperature Range | -40C to +70C |
| Ambient Humidity Range | 95% R.H. Max. |
| Contact Resistance | 100m max. |
| Insulation Resistance | 1000M min./500VDC |
| Mating Cycles (Standard) | 10,000 Insertions |
| Mating Cycles (Minimum) | 3,000 Insertions Min |
| Reflow Peak Temperature | 260C 5C, 3~5 S |
| GND Pin Definition | G1-GN pin is defined as GND |
2410121457_HanElectricity-NANO-1151_C5362201.pdf
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