electrical connection component Hanbo Electronic WAFER-HY200JK-4A with brass contacts and LCP PA66 base material
Product Overview
This product features brass contacts plated with tin, with a base material of LCP/PA66 (UL94V-0). Designed for reliable electrical connections, it offers a contact resistance of 10m and an insulation resistance of 1000M. It is rated for 250V AC/DC at 2.0A AC/DC and can withstand 1000V AC/Minute. The operating temperature range is -25C to +85C. The product also meets environmental requirements for lead and cadmium content.
Product Attributes
- Contact Material: Brass
- Contact Plating: Bottom Nickel plating on the entire surface, Re-tinning 80U" MIN
- Base Material: LCP/PA66 (UL94V-0)
- Color: White
- Environmental Compliance: Meets requirements for lead and cadmium (six hazardous substances).
Technical Specifications
| Specification | Value |
|---|---|
| Plastic Part Material | LCP (UL-94V-0) |
| Contact Resistance | 10m |
| Insulation Resistance | 1000M |
| Rated Voltage | 250V AC DC |
| Rated Current | 2.0A AC DC |
| Withstand Voltage | 1000V AC/Minute |
| Operating Temperature | -25C to +85C |
| Solderability Test (Immersion Tin Area) | 95% |
| Solderability Test (Temperature) | 220+5C |
| Solderability Test (Time) | 2.50.5 seconds |
| Dimensions (Base/Wafer) | 80.2 mm (Length) |
| Dimensions (Contact) | 5.100.2 mm (Length) |
| Dimensions (Contact Pin Diameter) | 0.500.05 mm |
| Dimensions (Contact Pin Spacing) | 2.000.10 mm |
| Dimensions (Center to Center) | 3.40.3 mm |
| Dimensions (Wafer Width) | 4.00 +0.15/-0.15 mm |
| Dimensions (Wafer Height) | 5.100.15 mm |
| PCB Layout Hole Diameter | 0.70.10 mm |
2410121223_Hanbo-Electronic-WAFER-HY200JK-4A_C22374507.pdf