electrical connector Hanbo Electronic WAFER-HY200JK-8A with brass contacts and nickel tin plating
Product Overview
This product features brass contacts plated with nickel and tin, housed in a white LCP/PA66 (UL94V-0) base. It is designed for electrical applications with a rated voltage of 250V AC/DC and a rated current of 2.0A AC/DC. The product meets stringent technical requirements including low contact resistance (10m), high insulation resistance (1000M), and excellent dielectric strength (1000V AC/Minute). It operates within a temperature range of -25C to +85C and is RoHS compliant, ensuring environmental safety. The suggested PCB layout is provided for easy integration.
Product Attributes
- Base/Wafer Material: LCP/PA66 (UL94V-0)
- Contact Material: Brass
- Plating: Nickel underplating, Tin plating (30U"MIN base, 80UMIN re-tinning)
- Color: White
- Environmental Compliance: Meets requirements for lead, cadmium, and six other hazardous substances.
Technical Specifications
| Specification | Value |
|---|---|
| Plastic Part Material | LCP/PA66 (UL94V-0) |
| Contact Plating | Nickel underplating, Tin plating (30U"MIN base, 80UMIN re-tinning) |
| Contact Resistance | 10m |
| Insulation Resistance | 1000M |
| Rated Voltage | 250V AC/DC |
| Rated Current | 2.0A AC/DC |
| Withstand Voltage | 1000V AC/Minute |
| Operating Temperature | -25C to +85C |
| Solderability Test (Immersion) | 95% tinning area, 220C 5C, 2.5 0.5 seconds |
| Dimensions (Base/Wafer) | 5.100.2 mm (Width) x 4.000.15 mm (Depth) |
| Contact Diameter | 0.500.05 mm |
| Pitch | 2.000.10 mm |
| Overall Height | 80.2 mm |
| PCB Layout Hole Diameter | 0.70.10 mm |
| PCB Layout Hole Spacing | 2.000.10 mm |
| PCB Layout Pad Size (A0.20) | 3.40.3 mm |
2410121223_Hanbo-Electronic-WAFER-HY200JK-8A_C22374511.pdf