brass tin plated terminals on white LCP PA66 base Hanbo Electronic WAFER-XH254JK-10A wafer connector
Product Overview
This product features brass terminals with a tin plating over nickel plating, offering 30" MIN and re-plated tin of 80" MIN. The base/wafer is constructed from white LCP/PA66 (UL94V-0). It is designed with specific technical parameters including pitch, temperature range, rated voltage, rated current, contact resistance, insulation resistance, and withstand voltage. The plastic housing is required to be smooth, free from burrs, shrinkage, defects, and cracks. The locking window specifications are also detailed, noting that variations in extraction force due to different positions are normal.
Product Attributes
- Base/Wafer Material: White LCP/PA66 (UL94V-0)
- Terminal/Contact Material: Brass
- Plating: Tin (entire surface with underlayer nickel plating)
- Tin Plating Thickness: 30" MIN (underlayer nickel), 80" MIN (re-plated tin)
- Housing Color: Natural
Technical Specifications
| Specification | Details |
|---|---|
| Pitch | [Value not provided] |
| Temperature Range | [Value not provided] C |
| Rated Voltage | [Value not provided] |
| Rated Current | [Value not provided] |
| Contact Resistance | [Value not provided] |
| Insulation Resistance | [Value not provided] |
| Withstand Voltage | [Value not provided] |
| Locking Window | [Number] for [Value not provided], [Number] for [Value not provided] |
Note on Plastic Housing: Surface should be smooth, free from burrs, obvious shrinkage, defects, cracks, etc.
Note on Extraction Force: Variations in extraction force due to different positions when engaging the cover are normal.
2410121226_Hanbo-Electronic-WAFER-XH254JK-10A_C22374533.pdf
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