Salt spray resistant phosphor copper connector HDGC HDGC2522-T with punch then plate plating process
Specifications
Contact Plating:
锡
Contact Material:
磷铜
Mfr. Part #:
HDGC2522-T
Model Number:
HDGC2522-T
Introduction
Product Overview
This product is manufactured by Shenzhen Huade co-create Technology Co.,LTD. It is designed with specific material, plating, and packaging requirements to meet industrial standards. The product undergoes a 'punch then plate' process with tin and nickel plating, and is tested for salt spray resistance.
Product Attributes
- Brand: Huade co-create Technology
- Origin: Shenzhen, China
- Material: Phosphor Copper C5191
- Material Thickness: T=0.200.02MM
- Plating Process: Punch then plate
- Plating Specification: Full Tin 50~80u", Ni Base 20~40u"
- Salt Spray Test: Minimum 12 hours
- Packaging: 10K per reel
- Connector Limit per Reel: Not exceeding 2
Technical Specifications
| Product Name | Part Number | Drawing Revision | Drawing Date | Scale | Unit Code | Number |
|---|---|---|---|---|---|---|
| HXB2.5-TER | HXB2.5-TER | A001 | NEW DWG | |||
| HDGC2522-T | HDGC2522-T | 1:1 |
2410121240_HDGC-HDGC2522-T_C2911747.pdf
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