NANO Self Ejecting SIM Card Tray 137H Second Generation Model HDGC K DYX 007 with 1 to 1 Form Factor
Manufacturer:
HDGC
Description:
Card Connector NANO SIM Push-Push Surface Mount
Category:
PC Card Sockets/PC Card Sockets
Specifications
Operating Temperature:
-40℃~+85℃
Card Connection Mode:
自弹式
Height Above Board:
1.37mm
Card Detection:
无插卡检测
Connector Type:
卡座
Card Type:
NanoSIM卡
Mfr. Part #:
K-DYX-007
Package:
SMD
Model Number:
K-DYX-007
Introduction
Product Overview
The K-DYX-007 NANO is a self-ejecting SIM card tray designed for seamless integration. This second-generation model, with a 1.37H specification, offers a compact 1:1 form factor. It is manufactured by Shenzhen Huade co-create Technology Co., LTD.
Product Attributes
- Brand: K-DYX
- Product Type: NANO Self-ejecting SIM Card Tray
- Origin: Shenzhen, China
- Manufacturer: Shenzhen Huade co-create Technology Co., LTD
Technical Specifications
| Product Name | Part No. | Description | Dimensions (mm) | Tolerance |
|---|---|---|---|---|
| NANO Self-ejecting SIM Card Tray | K-DYX-007 | 1.37H Second Generation | 1:1 | UNLESS OTHERWISE SPECIFIED |
Contact Information:
Company: Shenzhen Huade co-create Technology Co., LTD
Phone: 0755-23304126
Fax: 0755-29940187
2410121328_HDGC-K-DYX-007_C2919614.pdf
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