1.25MM Pitch HDGC HDGC1254WR-S-11P 90 Wafer Connector Suitable for Precise 1 to 1 Ratio Applications
Manufacturer:
HDGC
Description:
Connector Header 11 position 1.25mm Pitch 1A Surface Mount, Right Angle
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Y-Width Of Bottom Edge On Board:
6.5mm
Reference Series:
PanelMate(MX 1.25)
Pins Structure:
1x11P
Contact Plating:
金
Contact Material:
黄铜;-
Operating Temperature:
-25℃~+85℃
Flame Retardant Rating:
-
Supplementary Features:
辅助焊脚
Pitch:
1.25mm
Voltage Rating (Max):
125V
Number Of PINs Per Row:
11
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
-
Row Spacing:
-
Z-Height Of The Board:
1.85mm
Mounting Type:
卧贴
Mfr. Part #:
HDGC1254WR-S-11P
Package:
SMD,P=1.25mm,Surface Mount,Right Angle
Model Number:
HDGC1254WR-S-11P
Introduction
Product Overview
The HDGC1254WR-S-XP is a 1.25MM pitch, 90 wafer connector designed by Shenzhen Huade co-create Technology Co.,LTD. This product is suitable for applications requiring a 1:1 ratio connection.
Product Attributes
- Brand: Huade co-create Technology
- Origin: Shenzhen, China
Technical Specifications
| Parameter | Value |
|---|---|
| Product Name | HDGC1254WR-S-XP |
| Pitch | 1.25MM |
| Orientation | 90 Wafer |
| Ratio | 1:1 |
| Tolerances | Unless otherwise specified (mm) |
2410121336_HDGC-HDGC1254WR-S-11P_C5197193.pdf
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