Precision wafer connector HDGC HDGC1254WR-S-6P featuring 1.25MM pitch and 90 angle for electronics
Manufacturer:
HDGC
Description:
Connector Header 6 position 1.25mm Pitch 1A Surface Mount, Right Angle
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Male Pins
Specifications
Y-Width Of Bottom Edge On Board:
6.5mm
Reference Series:
PanelMate(MX 1.25)
Pins Structure:
1x6P
Contact Plating:
金
Contact Material:
黄铜;-
Operating Temperature:
-25℃~+85℃
Flame Retardant Rating:
-
Supplementary Features:
辅助焊脚
Pitch:
1.25mm
Voltage Rating (Max):
125V
Number Of PINs Per Row:
6
Number Of Rows:
1
X-Length Of Bottom Edge On Board (Spacing Line):
-
Row Spacing:
-
Z-Height Of The Board:
1.85mm
Mounting Type:
卧贴
Mfr. Part #:
HDGC1254WR-S-6P
Package:
SMD,P=1.25mm,Surface Mount,Right Angle
Model Number:
HDGC1254WR-S-6P
Introduction
Product Overview
The HDGC1254WR-S-XP is a wafer product with a 1.25MM pitch and a 90 angle, manufactured by Shenzhen Huade co-create Technology Co., LTD. This product is designed for applications requiring precise connections.
Product Attributes
- Brand: Huade co-create Technology
- Origin: Shenzhen, China
- Part Number: HDGC1254WR-S-XP
Technical Specifications
| Specification | Value |
|---|---|
| Pitch | 1.25MM |
| Angle | 90 |
| Type | Wafer |
| Tolerances | Unless otherwise specified (mm) |
2410121336_HDGC-HDGC1254WR-S-6P_C5197189.pdf
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