Durable microminiature connector ITT CANNON MTB1-65SL79 with hermetically sealed and filtered variants
Product Overview
ITT Cannon's Microminiature Connectors, particularly the MDM series, are designed for high-performance applications requiring extremely small, lightweight, and reliable interconnects. These connectors feature higher density contact configurations than traditional rectangular solutions without sacrificing quality. They are ideal for harsh environments and demanding applications such as aerospace, defense, industrial, transportation, and medical markets. Key technologies include the Cannon Twist Pin Contact System for reliable continuity under shock and vibration, and options for high-temperature operation up to 230C. The product line offers a wide range of configurations, including metal and plastic shells, PCB mountable options, coaxial and power combinations, filtered connectors, and hermetically sealed variants.
Product Attributes
- Brand: ITT Cannon
- Contact System: Twist Pin Contact System
- Certifications/Standards: MIL-DTL-83513 (for certain models)
- RoHS Compliance: Available (specified by product/plating options)
Technical Specifications
| Product Line/Series | Contact Spacing | Contact Material | Shell Material | Current Rating | Operating Temperature | Durability | Key Features |
|---|---|---|---|---|---|---|---|
| MDM Series (General) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum (Metal Shell) | 3A | -55C to +150C (Standard) | 500 mating cycles | Higher density, lightweight, EMI/RFI shielding, interfacial seal |
| MDM F222 (High Temp) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A | -55C to +200C | 500 mating cycles | Tested to withstand 200C for 500 hours |
| MDM F300 (Ultra-High Temp) | .050" (1.27 mm) | Gold plated copper alloy | Stainless Steel | 3A | -55C to +230C | 500 mating cycles | Tested to withstand 230C for 500 hours |
| MDLM (Low Profile) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A | -55C to +125C | 500 cycles min. | Thinner, lower profile design |
| MDM-PCB | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A | -55C to +125C | 500 cycles min. | Designed for flex circuitry, flat cable, PCBs |
| MDMH (Hermetic) | .050" (1.27 mm) | Gold plated copper alloy | Mild steel, tin-lead plated | N/A (Hermetic seal) | N/A (Hermetic seal) | N/A (Hermetic seal) | Compression glass sealed, leak rate 1 micron cubic ft/hr max |
| TMDM (Filter) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum alloy | 3 amps max. | N/A | N/A | Transverse monolith filters for noise reduction |
| MJS (Micro Center Jackscrew) | .050" (1.27 mm) | Copper alloy, 50 micro-inch gold | Diallyl phthalate, Polyester, Polyetherimide, Polyphenylene sulfide | N/A | -55C to +150C (depending on insulator) | N/A | Board-to-board, board-to-cable applications |
| MIK / MIKM / MIKQ (Circular) | .050" (1.27 mm) | Copper alloy, 50 microinch gold | Thermoplastic (MIK), Stainless Steel (MIKM) | 3 Amps | -55C to +125C | N/A | Rugged, lightweight, quick disconnect (MIKQ) |
| MT (Microstrips) | .050" (1.27 mm) / .100" (2.54 mm) | Copper Alloy, 50 Microinches Min. Gold Plated | MTV: Glass-filled Polyester; MTB: Glass-filled Diallyl Phthalate | 3 Amps max | -55C to +125C (MTV); -55C to +150C (MTB) | 500 cycles min. | High-density, latches/guide pins available |
| MEB (Micro Edgeboard) | .050" (1.27 mm) | Copper Alloy, 50 microinch gold | 6061-T6 Aluminum Alloy | N/A | N/A | N/A | For double or single-sided PC boards |
2412101902_ITT-CANNON-MTB1-65SL79_C22029739.pdf
