Lightweight Microminiature Connectors ITT CANNON MTB2-16SL1-01 with interconnects and high durability
Product Overview
ITT Cannon's Microminiature Connectors, featuring the advanced Twist Pin Contact System, are designed for high-performance applications requiring extremely small, lightweight, and reliable interconnects. These connectors offer higher density contact configurations than traditional rectangular solutions without sacrificing quality or performance. They are ideal for harsh environments and applications demanding durability, high shock and vibration resistance, and exceptional bandwidth. Key benefits include an ultra-small, lightweight, and high-performance form factor, positive locking latch, polarization key, and an excellent cost/performance ratio. ITT Cannon's portfolio includes a wide range of custom and off-the-shelf connectors and cable assemblies for Commercial Aerospace, Military & Defense, Transportation, Industrial, and Medical end markets.
Product Attributes
- Brand: ITT Cannon
- Contact System: Twist Pin Contact System
- Certifications: Designed to MIL-DTL-83513 specifications (for certain models)
- RoHS Compliance: Available (specific part numbers)
Technical Specifications
| Product Series | Contact Spacing | Contact Material | Current Rating | Durability | Operating Temperatures | Key Features |
|---|---|---|---|---|---|---|
| MDM (Micro-D Metal Shell) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | Standard: -55C to +150C High Temp: -55C to +200C Ultra-High Temp: -55C to +230C | Aluminum shells, silicone elastomer interfacial seal, higher density, EMI/RFI shielding |
| MDLM (Micro-D Metal Shell Low Profile) | .050" (1.27 mm) | Gold Plate over Copper Alloy | 3A max. | 500 cycles min. | -55C to +125C (MTV) / -55C to +150C (MTB) | Thinner, lower profile design, aluminum shell |
| MDM-PCB (Micro-D PCB) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Designed for flex circuitry, flat cable, and PCBs |
| MDM C/P (Coaxial/Power Combo) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Combines coaxial and/or power contacts with signal lines |
| MDMH (Hermetic Micro-D) | .050" (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Hermetically sealed, compression glass seal, steel shell |
| TMDM (Filter Micro-D) | .050" (1.27 mm) | Gold plated copper alloy | 3 amps max. | N/A | N/A | Transverse monolith filters for noise reduction, EMI/RFI/EMP shielding |
| MD*Plastic (Micro-D Plastic Shell) | .050" (1.27 mm) | Gold plate | N/A | N/A | N/A | Extremely small, lightweight, ruggedized plastic shells |
| MJS (Micro Center Jackscrew) | .050" (1.27 mm) | Copper alloy, 50 micro-inch gold | N/A | N/A | N/A | Board-to-board, board-to-cable, cable-to-cable applications |
| MIK (Microminiature Circular) | .050" (1.27 mm) | Copper Alloy, 50 Microinch Gold Plated | 3 Amps | 500 cycles min. | -55C to +125C | Ruggedized, lightweight, threaded coupling nuts, five-keyway polarization |
| MIKM (Microminiature Circular - Steel Shell) | .050" (1.27 mm) | Copper Alloy, 50 Microinch Gold Plated | 3 Amps | N/A | -55C to +125C | Steel shell for improved ruggedness and RFI resistance |
| MIKQ (Microminiature Circular - Push/Pull) | .050" (1.27 mm) | Copper Alloy, 50 Microinch Gold Plated | 3 Amps | N/A | -55C to +125C | Quick disconnect metal shell, push/pull coupling |
| MT (Microstrips) | .050" (1.27 mm) or .100" (2.54 mm) | Copper Alloy, 50 Microinches Min. Gold Plated | 3 Amps max | 500 cycles min. | MTV: -56C to +125C; MTB: -55C to +150C | High-density, available with latches or guide pins |
| MEB (Micro Edgeboard) | .050" (1.27 mm) | Copper Alloy, 50 microinch gold | N/A | N/A | N/A | Machined aluminum shells, diallyl phthalate insulator, 36-position polarization |
2412101902_ITT-CANNON-MTB2-16SL1-01_C22240710.pdf
