microminiature connector ITT CANNON MTB1-13SL2 ideal for aerospace defense and transportation sectors
Manufacturer:
ITT CANNON
Description:
Headers, Receptacles, Female Sockets RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Mfr. Part #:
MTB1-13SL2
Model Number:
MTB1-13SL2
Introduction
ITT Cannon Microminiature Connectors
ITT Cannon offers a comprehensive range of microminiature interconnect solutions designed for high-performance applications in harsh environments. These connectors are characterized by their small, lightweight, and high-density configurations, utilizing the proven Cannon Twist Pin Contact System for reliable electrical continuity and mechanical engagement. They are suitable for demanding markets such as aerospace, defense, industrial, transportation, and medical, where extreme conditions of shock, vibration, and temperature are prevalent. The portfolio includes various series like MDM, MDLM, MDM-PCB, and specialized high-temperature variants, providing versatile solutions for data, power, and signal transmission.
- Brand: ITT Cannon
- Technology: Twist Pin Contact System
- Key Features: Simple installation, hand-insertable contacts, positive locking latch, polarization key, high-density contact configurations, rugged design.
- Applications: Aerospace, Defense, Industrial, Transportation, Medical, Geophysical Exploration, Oil & Gas, High-Speed Computer Networking, Industrial Automation, Satellite and Space Communications, Telecommunications.
Technical Specifications
| Series | Contact Spacing | Contact Material | Current Rating | Durability | Operating Temperature | Key Features |
|---|---|---|---|---|---|---|
| MDM (Micro-D Metal Shell) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +150C (Standard) | Aluminum shells, EMI/RFI shielding, silicone elastomer interfacial seal, MIL-DTL-83513 compliant. |
| MDM F222 (High Temp) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +200C | Tested to withstand 200C continuous operating temperature for 500 hours. |
| MDM F300 (Ultra-High Temp) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +230C | Tested to withstand 230C continuous operating temperature for 500 hours. |
| MDLM (Micro-D Metal Shell, Low Profile) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +125C | Thinner, lower profile design. |
| MDM-PCB (Micro-D PCB) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | -55C to +125C | Designed for flex circuitry, flat cable, and printed circuit boards. |
| MDMH (Hermetic Micro-D) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Hermetically sealed, compression glass seal, steel shell. |
| TMDM (Filter Micro-D) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Transverse monolith filters for noise reduction, EMI/RFI/EMP shielding. |
| MJS (Micro Center Jackscrew) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Board-to-board, board-to-cable, cable-to-cable applications. |
| MIK (Micro Circular) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 cycles min. | -55C to +125C | Rugged, lightweight, circular design, MIL-DTL-83513 applicable requirements. |
| MT (Microstrips) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 cycles min. | -55C to +150C (MTB) | Extremely dense, reliable interconnection, minimum profile package. |
| MEB (Micro Edgeboard) | .050" (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Designed for PC board edge termination. |
2412101902_ITT-CANNON-MTB1-13SL2_C22099914.pdf
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