lightweight ITT CANNON MTB1-4SAL79 connector with hand insertable contacts and no wedge locks needed
Manufacturer:
ITT CANNON
Description:
Headers, Receptacles, Female Sockets RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Mfr. Part #:
MTB1-4SAL79
Model Number:
MTB1-4SAL79
Introduction
Product Overview
ITT Cannon's Microminiature Connectors are designed for high-performance applications requiring extremely small, lightweight, and reliable interconnects. Featuring the Cannon-engineered Micro Twist Pin Contact System, these connectors offer higher density contact configurations than traditional rectangular solutions without sacrificing quality or performance. They are ideal for harsh environments and applications demanding ultra-lightweight, space-saving solutions. Key benefits include an ultra-small, lightweight, high-performance form factor, durability to withstand shock and vibration, and unique mechanical engagement and locking mechanisms. ITT Cannon provides a broad portfolio of custom and off-the-shelf connectors and cable assemblies for various demanding end markets.
Product Attributes
- Brand: ITT Cannon
- Contact System: Micro Twist Pin Contact System
- Key Features: Hand insertable contacts, no wedge locks or blind seals required, positive locking latch & polarization key, excellent cost/performance ratio.
- RoHS Compliance: Available for certain part numbers and plating options.
Technical Specifications
| Model/Series | Contact Spacing | Contact Material | Current Rating | Durability | Operating Temperatures | Key Features/Applications |
|---|---|---|---|---|---|---|
| MDM (Micro-D Metal Shell) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | Standard: -55C to +150C High Temp: -55C to +200C Ultra-High Temp: -55C to +230C | MIL-DTL-83513 compliant, aluminum shells for EMI/RFI shielding, silicone elastomer interfacial seal. Available in 8 shell sizes (9 to 100 contacts). |
| MDLM (Micro-D Metal Shell, Low Profile) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 cycles min. | -55C to +125C (MTV) -55C to +150C (MTB) | Thinner, lower profile design for harsh environment applications. Available in 7 shell sizes (9 to 51 contacts). |
| MDM-PCB (Micro-D PCB) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Designed for flex circuitry, flat cable, and printed circuit boards. Available in 8 shell sizes (9 to 100 contacts). |
| MDM C/P (Micro-D Coaxial/Power) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Combines coaxial and signal lines, or power and signal lines, in the same connector. Available in various coaxial and power layouts. |
| MDM F222 (High Temp Micro) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 hours at 200C | Up to 200C continuous | Tested to withstand 200C continuous operating temperature. Suitable for Oil and Gas exploration. |
| MDM F300 (Ultra-High Temp Micro) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 hours at 230C | Up to 230C continuous | Tested to withstand 230C continuous operating temperature. Suitable for Oil and Gas exploration. |
| MDMH (Hermetic Micro) | .050 (1.27 mm) | Gold plated copper alloy (sockets) | N/A | 1 micron cubic ft/hr max leak rate | N/A | Compression glass sealed for vacuum or controlled pressure applications. Steel shell, diallyl phthalate insulator. |
| TMDM (Filter Micro) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps max. | N/A | N/A | Features transverse monolith filters for noise reduction and EMI/RFI/EMP shielding. Environmentally sealed. Available in 9 to 37 contacts. |
| MD* Plastic Shell | .050 (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Lightweight, extremely small, highly reliable plastic connectors. Available in thermoset or thermoplastic insulators. |
| MJS (Micro Center Jackscrew) | .050 (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Reliable interconnect for board-to-board, board-to-cable, and cable-to-cable applications. Available in unshrouded and shrouded configurations. |
| MIK (Micro Circular) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps | 500 cycles min. | -55C to +125C | Rugged, lightweight, circular connectors meeting MIL-DTL-83513 requirements. Available in thermoplastic or steel shells. |
| MIKM (Micro Circular Metal Shell) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps | 500 cycles min. | -55C to +125C | Steel shell for improved ruggedness and RFI resistance. Threaded coupling nuts. |
| MIKQ (Micro Circular Push/Pull) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps | N/A | -55C to +125C | Quick disconnect metal shell with push/pull coupling. Available in jam nut mount and rear panel mount receptacle styles. |
| MT (Microstrips) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps max. | 500 cycles min. | -55C to +125C (MTV) -55C to +150C (MTB) | Extremely dense and reliable interconnection solution with high performance MicroPin Contact System. Available with latches or guide pins. |
| MEB (Micro Edgeboard) | .050 (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Machined aluminum shells for ruggedness, diallyl phthalate insulator. Designed for PC board mounting. |
Specifications and dimensions subject to change.
2411061522_ITT-CANNON-MTB1-4SAL79_C21930492.pdf
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