1.25mm pitch 90 wafer SMT connector with LCP housing and brass Sn-plated nail JIDC 991-081-7022
Manufacturer:
JIDC
Description:
SMD,P=1.25mm,Surface Mount,Right Angle Headers, Male Pins RoHS
Category:
Headers, Male Pins/Headers, Male Pins
Specifications
Mfr. Part #:
991-081-7022
Package:
SMD,P=1.25mm,Surface Mount,Right Angle
Model Number:
991-081-7022
Introduction
Product Overview
This product is a 1.25mm pitch, 90 wafer SMT connector designed for various electronic applications. It features robust construction with LCP housing and phosphor bronze contacts, ensuring reliable performance.
Product Attributes
- Brand: Guangdong JiDe Precision Electronics Co., Ltd
- Housing Material: LCP UL94V-0
- Contact Material: Phosphor Bronze Sn-Plated
- Nail Material: Brass Sn-Plated
- RoHS Compliance: Yes
- Color Options: Natural (), Black ()
Technical Specifications
| Specification | Value |
|---|---|
| Pitch | 1.25mm |
| Type | 90 Wafer SMT |
| Contact Resistance | ≤ 20mΩ |
| Insulation Resistance | ≥ 100MΩ |
| Rated Voltage | 125V AC/DC |
| Rated Current | 1.0A AC/DC |
| Withstand Voltage | 500V AC/minute |
| Operating Temperature Range | -25°C to +85°C |
| Number of Circuits | 02-15 |
| Housing | LCP UL94V-0 |
| Contacts | Phosphor Bronze Sn-Plated |
| Nail | Brass Sn-Plated |
| Order Information Principle | 991-XX X-7022 7 8 D C B 1 2 3 4 5 6 1 2 3 4 E A E D C B A |
| Dimensions (General Tolerance) | .XXX± 0.15, .XX± 0.20, .X± 0.30, X.± 0.50 |
| DIM.A | 1.25 ± 0.25 |
| DIM.B | 3.60 ± 0.15 |
| DIM.C | 5.50 ± 0.3 |
| DIM.D | 2.40 ± 0.25 |
| Housing Dimension A | 4.40 ± 0.25 |
| Housing Dimension B | 3.50 ± 0.15 |
| Housing Dimension C | 1.00 MAX |
| Housing Dimension D | 0.10 MAX |
| Wafer Dimension A | 0.30 ± 0.03 |
| Wafer Dimension B | 1.25 |
| Wafer Dimension C | 3.50 |
| Wafer Dimension D | 2.40 |
2504101957_JIDC-991-081-7022_C42428370.pdf
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