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Compact lightweight connector ITT CANNON MTB1-20SAL39-2 featuring Micro Twist Pin Contact System for interconnects

Manufacturer:
ITT CANNON
Description:
Headers, Receptacles, Female Sockets RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Mfr. Part #:
MTB1-20SAL39-2
Model Number:
MTB1-20SAL39-2
Introduction

Product Overview

ITT Cannon's Microminiature Connectors are designed for high-performance applications requiring extremely small, lightweight, and reliable interconnects. These connectors feature higher density contact configurations than traditional rectangular solutions without sacrificing quality or performance. They are ideal for harsh environments and offer advanced features like the Cannon-engineered Micro Twist Pin Contact System for maximum performance and unique mechanical engagement and locking mechanisms for reliability. Applications span across commercial aerospace, military & defense, transportation, industrial, and medical end markets, including automated space vehicles and oil & gas exploration.

Product Attributes

  • Brand: ITT Cannon
  • Contact System: Micro Twist Pin Contact System
  • Key Technology: Twist Pin Technology
  • Certifications: Designed to MIL-DTL-83513 specifications (for certain models)
  • RoHS Compliance: Available (see specific product details)

Technical Specifications

Product Line Contact Spacing Key Features Current Rating Durability Operating Temperatures Shell Material Contact Material
MDM Micro-D (MIL-DTL-83513) .050 (1.27mm) Micro Twist Pin Contact System, positive locking latch, polarization key, higher density, aluminum shells for EMI/RFI shielding, silicone elastomer interfacial seal. 3A max. 500 mating cycles Standard: -55C to +150C
High Temp: -55C to +200C
Ultra-High Temp: -55C to +230C
Aluminum Gold plated copper alloy
MDLM Micro-D Metal Shell, Low Profile .050 (1.27mm) Thinner, lower profile design, meets MIL-DTL-83513 performance criteria. 3A max. 500 cycles min. -55C to +125C (MTV insulator)
-55C to +150C (MTB insulator)
Aluminum Alloy Gold Plate
MDM F222 High Temp Micro .050 (1.27mm) Tested to withstand 200C continuous operating temperature for 500 hours. 3A max. 500 mating cycles Up to 200C Aluminum alloy Gold plated copper alloy
MDM F300 Ultra-High Temp Micro .050 (1.27mm) Tested to withstand 230C continuous operating temperature for 500 hours. 3A max. 500 mating cycles Up to 230C Aluminum alloy Gold plated copper alloy
MDMH Hermetic Micro .050 (1.27mm) Compression glass sealed, steel shell, hermetically sealed. 3A max. N/A N/A Mild steel, tin-lead plated Gold plated copper alloy
TMDM Filter Micro .050 (1.27mm) Transverse monolith filters for noise reduction and EMI/RFI/EMP shielding, ruggedized one-piece aluminum shell. 3 amps max. N/A N/A Aluminum alloy Gold plated copper alloy
MD* Plastic Micro-D .050 (1.27mm) Extremely small, lightweight, ruggedized, all-plastic shells. N/A N/A N/A Glass-filled thermoset or thermoplastic plastic Gold plate
MJS Micro Center Jackscrew .050 (1.27mm) Reliable interconnect for board-to-board, board-to-cable, and cable-to-cable. N/A N/A N/A N/A Copper alloy
MIK Micro Circular .050 (1.27mm) Ruggedized, lightweight, threaded coupling nuts, five-keyway polarization. 3 Amps 500 cycles min. -55C to +125C Thermoplastic (MIK), Stainless Steel (MIKM) Copper Alloy
MIKQ Micro Circular .050 (1.27mm) Quick disconnect metal shell, push/pull coupling. 3 Amps N/A -55C to +125C Brass Copper Alloy
MT* Microstrips .050 (1.27mm) Extremely dense, reliable interconnection, high-density, optional latches/guide pins. 3 Amp current rating 500 cycles min. MTV: 125C
MTB: 150C
N/A Copper Alloy
MEB Micro Edgeboard .050 (1.27mm) Machined aluminum shells, 36-position polarization key system, termination for PC boards. N/A N/A N/A Aluminum Alloy, Diallyl Phthalate or Polyester Copper Alloy

2412101902_ITT-CANNON-MTB1-20SAL39-2_C22310697.pdf

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