Compact lightweight connector ITT CANNON MTB1-20SAL39-2 featuring Micro Twist Pin Contact System for interconnects
Product Overview
ITT Cannon's Microminiature Connectors are designed for high-performance applications requiring extremely small, lightweight, and reliable interconnects. These connectors feature higher density contact configurations than traditional rectangular solutions without sacrificing quality or performance. They are ideal for harsh environments and offer advanced features like the Cannon-engineered Micro Twist Pin Contact System for maximum performance and unique mechanical engagement and locking mechanisms for reliability. Applications span across commercial aerospace, military & defense, transportation, industrial, and medical end markets, including automated space vehicles and oil & gas exploration.
Product Attributes
- Brand: ITT Cannon
- Contact System: Micro Twist Pin Contact System
- Key Technology: Twist Pin Technology
- Certifications: Designed to MIL-DTL-83513 specifications (for certain models)
- RoHS Compliance: Available (see specific product details)
Technical Specifications
| Product Line | Contact Spacing | Key Features | Current Rating | Durability | Operating Temperatures | Shell Material | Contact Material |
|---|---|---|---|---|---|---|---|
| MDM Micro-D (MIL-DTL-83513) | .050 (1.27mm) | Micro Twist Pin Contact System, positive locking latch, polarization key, higher density, aluminum shells for EMI/RFI shielding, silicone elastomer interfacial seal. | 3A max. | 500 mating cycles | Standard: -55C to +150C High Temp: -55C to +200C Ultra-High Temp: -55C to +230C | Aluminum | Gold plated copper alloy |
| MDLM Micro-D Metal Shell, Low Profile | .050 (1.27mm) | Thinner, lower profile design, meets MIL-DTL-83513 performance criteria. | 3A max. | 500 cycles min. | -55C to +125C (MTV insulator) -55C to +150C (MTB insulator) | Aluminum Alloy | Gold Plate |
| MDM F222 High Temp Micro | .050 (1.27mm) | Tested to withstand 200C continuous operating temperature for 500 hours. | 3A max. | 500 mating cycles | Up to 200C | Aluminum alloy | Gold plated copper alloy |
| MDM F300 Ultra-High Temp Micro | .050 (1.27mm) | Tested to withstand 230C continuous operating temperature for 500 hours. | 3A max. | 500 mating cycles | Up to 230C | Aluminum alloy | Gold plated copper alloy |
| MDMH Hermetic Micro | .050 (1.27mm) | Compression glass sealed, steel shell, hermetically sealed. | 3A max. | N/A | N/A | Mild steel, tin-lead plated | Gold plated copper alloy |
| TMDM Filter Micro | .050 (1.27mm) | Transverse monolith filters for noise reduction and EMI/RFI/EMP shielding, ruggedized one-piece aluminum shell. | 3 amps max. | N/A | N/A | Aluminum alloy | Gold plated copper alloy |
| MD* Plastic Micro-D | .050 (1.27mm) | Extremely small, lightweight, ruggedized, all-plastic shells. | N/A | N/A | N/A | Glass-filled thermoset or thermoplastic plastic | Gold plate |
| MJS Micro Center Jackscrew | .050 (1.27mm) | Reliable interconnect for board-to-board, board-to-cable, and cable-to-cable. | N/A | N/A | N/A | N/A | Copper alloy |
| MIK Micro Circular | .050 (1.27mm) | Ruggedized, lightweight, threaded coupling nuts, five-keyway polarization. | 3 Amps | 500 cycles min. | -55C to +125C | Thermoplastic (MIK), Stainless Steel (MIKM) | Copper Alloy |
| MIKQ Micro Circular | .050 (1.27mm) | Quick disconnect metal shell, push/pull coupling. | 3 Amps | N/A | -55C to +125C | Brass | Copper Alloy |
| MT* Microstrips | .050 (1.27mm) | Extremely dense, reliable interconnection, high-density, optional latches/guide pins. | 3 Amp current rating | 500 cycles min. | MTV: 125C MTB: 150C | N/A | Copper Alloy |
| MEB Micro Edgeboard | .050 (1.27mm) | Machined aluminum shells, 36-position polarization key system, termination for PC boards. | N/A | N/A | N/A | Aluminum Alloy, Diallyl Phthalate or Polyester | Copper Alloy |
2412101902_ITT-CANNON-MTB1-20SAL39-2_C22310697.pdf