Microminiature connectors ITT CANNON MTB1-81SAL1 offering twist pin contact system and gold plating
Manufacturer:
ITT CANNON
Description:
Headers, Receptacles, Female Sockets RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Mfr. Part #:
MTB1-81SAL1
Model Number:
MTB1-81SAL1
Introduction
Product Overview
ITT Cannon's Microminiature Connectors are designed for high-performance, space-saving applications requiring reliable interconnects in harsh environments. Featuring the Cannon Twist Pin Contact System, these connectors offer higher density than traditional rectangular solutions without sacrificing quality. They are ideal for markets and applications demanding extremely small, lightweight, and robust connections, including aerospace, defense, industrial, and transportation sectors.
Product Attributes
- Brand: ITT Cannon
- Contact System: Twist Pin Contact System
- Certifications: Designed to MIL-DTL-83513 specifications (for certain models)
- RoHS Compliance: Available with RoHS compliant part numbers & plating options
Technical Specifications
| Series/Model | Contact Spacing | Contact Material | Current Rating | Durability | Operating Temperatures | Key Features |
|---|---|---|---|---|---|---|
| MDM (Micro-D Metal Shell) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | Standard: -55C to +150C High Temp: -55C to +200C Ultra-High Temp: -55C to +230C | Higher density contact configurations, Aluminum shells for strength and EMI/RFI shielding, Silicone elastomer interfacial seal |
| MDM-PCB (Micro-D PCB) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | - | Designed for flex circuitry, flat cable, and printed circuit boards |
| MDLM (Micro-D Metal Shell, Low Profile) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | - | Thinner, lower profile design for harsh environments |
| MDM C/P (Micro-D Coaxial/Power) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | - | Combines coaxial and signal lines, or power and signal lines, in the same connector |
| MDMH (Hermetic Micro) | .050 (1.27 mm) | Gold plated copper alloy sockets / gold plated pins | - | - | - | Compression glass sealed, steel shell, leak rate 1 micron cubic ft/hr max |
| TMDM (Filter Micro) | .050 (1.27 mm) | Gold plated copper alloy | 3A max. | - | - | Transverse monolith filters for noise reduction and EMI/RFI/EMP shielding |
| MD*Plastic (Micro-D Plastic Shell) | .050 (1.27 mm) | Gold plated copper alloy | - | - | - | Extremely small, lightweight, ruggedized plastic shells |
| MJS (Micro Center Jackscrew) | .050 (1.27 mm) | Gold plated copper alloy | - | - | - | Board-to-board, board-to-cable, and cable-to-cable applications |
| MIK (Micro Circular) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps | 500 cycles min. | -55C to +125C | Ruggedized, lightweight, threaded coupling nuts, five-keyway polarization |
| MIKM (Micro Circular Metal Shell) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps | 500 cycles min. | -55C to +125C | Steel shell for improved ruggedness and RFI resistance, threaded coupling nuts |
| MIKQ (Micro Circular Push/Pull) | .050 (1.27 mm) | Gold plated copper alloy | 3 Amps | - | -55C to +125C | Quick disconnect metal shell, push/pull coupling |
| MT* (Microstrips) | .050 (1.27 mm) & .100 (2.54 mm) | Gold plated copper alloy | 3 Amps max. | 500 cycles min. | MTV: -55C to +125C MTB: -55C to +150C | High-density, available with latches or guide pins |
| MEB (Micro Edgeboard) | .050 (1.27 mm) | Gold plated copper alloy | - | - | - | Machined aluminum shells, 36-position polarization key system |
2412101902_ITT-CANNON-MTB1-81SAL1_C22240709.pdf
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