Space saving microminiature connector ITT CANNON MTB1-8SAL1-01 with gold plated copper alloy contacts
Manufacturer:
ITT CANNON
Description:
Headers, Receptacles, Female Sockets RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Headers, Receptacles, Female Sockets
Specifications
Mfr. Part #:
MTB1-8SAL1-01
Model Number:
MTB1-8SAL1-01
Introduction
Product Overview
ITT Cannon's Microminiature Connectors offer ultra-lightweight, space-saving solutions designed for high-performance in harsh environments. Featuring the Cannon Twist Pin Contact System, these connectors provide reliable interconnects for applications requiring high density and exceptional durability under severe shock and vibration. They are suitable for demanding markets such as aerospace, defense, industrial, and transportation, ensuring data, power, and signal integrity where it matters most.
Product Attributes
- Brand: ITT Cannon
- Contact System: Cannon Twist Pin Contact System
- Certifications: MIL-DTL-83513 (for specific models)
- RoHS Compliance: Available for specific part numbers and plating options
Technical Specifications
| Series/Model | Contact Spacing | Contact Material | Shell Material | Current Rating | Durability | Operating Temperature | Key Features |
|---|---|---|---|---|---|---|---|
| MDM (Micro-D Metal Shell) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A max. | 500 mating cycles | -55C to +150C (Standard) | Higher density, EMI/RFI shielding, interfacial seal |
| MDM-F222 (High Temp Micro) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A max. | 500 mating cycles | -55C to +200C | Tested to withstand 200C continuous operating temperature for 500 hours |
| MDM-F300 (Ultra-High Temp Micro) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A max. | 500 mating cycles | -55C to +230C | Tested to withstand 230C continuous operating temperature for 500 hours |
| MDLM (Micro-D Metal Shell, Low Profile) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A max. | 500 mating cycles | -55C to +125C | Thinner, lower profile design |
| MDMH (Hermetic Micro) | .050" (1.27 mm) | Gold plated copper alloy | Steel | 3A max. | N/A | N/A | Hermetically sealed, compression glass seal |
| TMDM (Filter Micro) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum | 3A max. | N/A | N/A | Transverse monolith filters for noise reduction, EMI/RFI/EMP shielding |
| MD* (Plastic Shell) | .050" (1.27 mm) | Gold plated copper alloy | Plastic (Thermoset or Thermoplastic) | 3A max. | N/A | N/A | Lightweight, ruggedized, wide versatility |
| MJS (Micro Center Jackscrew) | .050" (1.27 mm) | Gold plated copper alloy | Diallyl phthalate, Polyester, Polyetherimide, Polyphenylene sulfide | 3A max. | N/A | N/A | Board-to-board, board-to-cable, cable-to-cable applications |
| MIK (Micro Circular) | .050" (1.27 mm) | Gold plated copper alloy | Thermoplastic or Steel | 3A max. | 500 cycles min. | -55C to +125C | Ruggedized, lightweight, push/pull or screw coupling |
| MT* (Microstrips) | .050" (1.27 mm) or .100" (2.54 mm) | Gold plated copper alloy | Polyester or Diallyl phthalate | 3A max. | 500 cycles min. | -55C to +150C | High-density, latches, guide pins, potted wire terminations |
| MEB (Micro Edgeboard) | .050" (1.27 mm) | Gold plated copper alloy | Aluminum or Polyester | N/A | N/A | N/A | 90 or right angle PC board termination, polarization key system |
2412101902_ITT-CANNON-MTB1-8SAL1-01_C22223162.pdf
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