microminiature connector ITT CANNON MTB1-60SL80 designed for harsh environments and demanding industrial uses
Product Overview
ITT Cannon's Microminiature Connectors are designed for high-performance applications requiring extremely small, lightweight, and reliable interconnects. These connectors offer higher density contact configurations than traditional rectangular solutions without sacrificing quality or performance. They are ideal for harsh environments and feature Cannon's Twist Pin Contact System for enhanced reliability, low engagement/separation forces, and durability under severe shock and vibration. Applications span across aerospace, defense, industrial, transportation, and medical sectors, including automated space vehicles and oil & gas exploration.
Product Attributes
- Brand: ITT Cannon
- Contact System: Twist Pin Contact System
- Certifications: Designed to MIL-DTL-83513 specifications (for certain models)
- Compliance: RoHS compliant part numbers & plating options available
- Origin: USA (implied by ITT HQ location)
Technical Specifications
| Series | Contact Spacing | Contact Material | Current Rating | Durability | Operating Temperatures | Key Features |
|---|---|---|---|---|---|---|
| MDM (Micro-D Metal Shell) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | Standard: -55C to +150C High Temp: -55C to +200C Ultra-High Temp: -55C to +230C | Higher density contact configurations, Aluminum shells for increased strength and EMI/RFI shielding, Silicone elastomer interfacial seal. |
| MDM-PCB (Micro-D PCB) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | N/A | Designed for flex circuitry, flat cable, and printed circuit boards. |
| MDLM (Micro-D Metal Shell, Low Profile) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | 500 mating cycles | N/A | Thinner, lower profile design package. |
| MDM C/P (Micro-D Coaxial/Power) | .050" (1.27 mm) | Gold plated copper alloy | 3A max. | N/A | N/A | Combines coaxial and signal lines, or power and signal lines in the same connector. |
| MDMH (Hermetic Micro-D) | .050" (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Hermetically-sealed, compression glass sealed through steel shell. Leak rate 1 micron cubic ft/hr max. |
| TMDM (Filter Micro-D) | .050" (1.27 mm) | Gold plated copper alloy | 3 amps max. | N/A | N/A | Transverse monolith filters for noise reduction and EMI/RFI/EMP shielding. Environmentally sealed. |
| MD*Plastic (Micro-D Plastic Shell) | .050" (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Extremely small, lightweight, and ruggedized all-plastic shells. Available with clip mounting or screw mounting. |
| MJS (Micro Center Jackscrew) | .050" (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Reliable interconnect for board-to-board, board-to-cable, and cable-to-cable applications. Available in unshrouded and shrouded configurations. |
| MIK (Micro Circular) | .050" (1.27 mm) | Gold plated copper alloy | 3 Amps | 500 cycles min. | -55C to +125C | Ruggedized, lightweight, threaded coupling nuts, five-keyway polarization. |
| MIKM (Micro Circular - Metal Shell) | .050" (1.27 mm) | Gold plated copper alloy | 3 Amps | N/A | -55C to +125C | Steel shell for improved ruggedness and RFI resistance, threaded coupling nuts. |
| MIKQ (Micro Circular - Push/Pull) | .050" (1.27 mm) | Gold plated copper alloy | 3 Amps | N/A | -55C to +125C | Quick disconnect metal shell, push/pull coupling. |
| MT* (Microstrips) | .050" (1.27 mm) | Gold plated copper alloy | 3 Amps max | 500 cycles min. | MTV: -55C to +125C MTB: -55C to +150C | High-density, available with latches or guide pins, multiple termination styles (solder cup, pigtail, PC leads). |
| MEB (Micro Edgeboard) | .050" (1.27 mm) | Gold plated copper alloy | N/A | N/A | N/A | Machined aluminum shells, diallyl phthalate insulator, 36-position polarization key system. Termination types for PC boards. |
2412101902_ITT-CANNON-MTB1-60SL80_C22003165.pdf