gold plated terminal FPC FFC connector JUSHUO AFA01 S08FCA 00 1.0mm pitch flip top lower connect type
Product Overview
The AFA01-S**FCA-00 is a 1.0mm pitch FPC/FFC connector with a flip-top, lower-connect design, suitable for applications requiring a secure and reliable connection. It is designed for use with flexible printed circuits and flexible flat cables, offering a rated voltage of 50V and a rated current of 0.4A/0.5A AC/DC. The connector operates within a temperature range of -45C to +85C and features gold-plated terminals for enhanced conductivity and durability. Available in tape and reel or tube packaging, it is designed for automated assembly processes.
Product Attributes
- Brand: JUSHUO ()
- Origin: Shenzhen, China
- Series: AFA01-S
- Type: FPC/FFC Connector
- Pitch: 1.0mm
- Connection Type: Lower Connect, Flip-Top
- Housing Material: LCP UL94V-0 (Nature or Black)
- Terminal Material: Phosphor Copper (Au/Sn Plated)
- Solder Material: Copper Alloy (Au/Sn Plated)
- Plating Options: Gold flash (1", 2", 3"), Bright-Tin, Matt-Tin
- Packaging Options: Tape & Reel (FCA-00), Tube (FCC-00)
- RoHS Compliant: Yes
Technical Specifications
| Specification | Requirement |
|---|---|
| Part Number | AFA01-S**FCA-00 |
| Product Name | FPC Connector 1.0mm Pitch Flip-Top Lower Connect H2.0 |
| Rated Voltage (MAX) | 50V AC/DC |
| Rated Current (MAX) | 0.4A AC/DC (0.5A AC/DC specified in other sections) |
| Operating Temperature Range | -45C to +85C |
| Contact Resistance | 20 m (MAX) |
| Insulation Resistance | 500 M (MIN) |
| Withstanding Voltage | 200V AC/minute (No Breakdown) |
| Locking Force (N) | 1.96*n (MAX) |
| Withdrawal Force (N) | 0.49*n (MIN) |
| Terminal Retention Force (N) | 3.92N (MIN) |
| Repeated Insertion/Withdrawal (Cycles) | 20 Cycles |
| Temperature Rise (C) | 30C (MAX) |
| Vibration Resistance (Discontinuity) | 1 ms (MAX) |
| Shock Resistance (Discontinuity) | 1 ms (MAX) |
| Heat Resistance (Contact Resistance) | 60 m (MAX) |
| Cold Resistance (Contact Resistance) | 60 m (MAX) |
| Humidity Resistance (Insulation Resistance) | 20 M (MIN) |
| Temperature Cycling (Contact Resistance) | 60 m (MAX) |
| Salt Spray Resistance (Contact Resistance) | 60 m (MAX) |
| SO2 Gas Resistance (Contact Resistance) | 60 m (MAX) |
| NH3 Gas Resistance (Contact Resistance) | 60 m (MAX) |
| Solderability (Wetting) | 95% or more |
| Resistance to Soldering Heat (Appearance) | No damage, deformation |
| PC Board Layout Dimensions (Example for 4 Contacts) | A: 3.00, B: 5.10, C: 8.30, D: 9.90 (Refer to detailed table for other contact counts) |
2504101957_JUSHUO-AFA01-S08FCA-00_C262755.pdf