Kinghelm KH A12501 02Y ultra thin 1.25 series connector for secure and stable electrical connections
Product Overview
The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in various applications. This series emphasizes a compact, ultra-thin profile, making it suitable for space-constrained designs. It offers robust performance with specified electrical and mechanical characteristics, ensuring dependable operation under various environmental conditions. Key applications include scenarios requiring secure and stable connections with defined voltage and current ratings.
Product Attributes
- Series: 1.25 Ultra-Thin Series
- Brand: Kinghelm ()
- Model/Part Number: KH-A12501-02Y
- Environmental Protection Grade: RoHS2.0
- Housing Color: White
- Wafer Color: Beige
Technical Specifications
| Category | Item | Specification | Details |
|---|---|---|---|
| Materials & Surface Treatment | Terminal Material | Phosphor bronze | Thickness: 0.15mm |
| Terminal Finish | Tin Plating | 2.5-5m | |
| Housing Material | PBT | UL94V-0 | |
| Wafer Material | PA9T Plastic | UL94V-0 | |
| Ratings & Applicable Wires | Rated Voltage | 125V AC/DC | |
| Rated Current | 1A AC/DC | ||
| Ambient Temperature Range | -25 to +85 | ||
| Applicable Wire Gauge | AWG28#-32# | ||
| Electrical Performance | Contact Resistance (Initial) | 20m Max | Male/Female cooperation, < 20mV open voltage, 100mA current |
| Contact Resistance (After Test) | 30m Max | ||
| Withstand Voltage | 500V AC for 1 minute | Between adjacent terminals or ground; No breakdown/flashover | |
| Insulation Resistance | 100M Min | 500V DC between adjacent terminals or ground | |
| Mechanical Performance | Terminal Crimping Wire Strength (AWG#28) | 13N | Axial pull-out force |
| Terminal Crimping Wire Strength (AWG#30) | 8N | Axial pull-out force | |
| Terminal Crimping Wire Strength (AWG#32) | 6N | Axial pull-out force | |
| Terminal Retention Force (Per Contact) | 8N Min | Axial pull-out force at 25.43mm/min | |
| Pin Retention Force (Per Contact) | 2N Min | Axial push force at 25.43mm/min | |
| Endurance Characteristics | Repeated Insertion/Withdrawal | 30 m Max (Contact Resistance) | 30 cycles at rate 10 cycles/min |
| Temperature Rise | 30 Max | At rated current until thermal stability | |
| Vibration Test | Appearance: No damage; Contact Resistance: 30 m Max; Discontinuity: 1 micro-second Max | Amplitude: 1.5mm P-P; 10-55-10 Hz; 2 hours per X,Y,Z axis | |
| Heat Resistance | Appearance: No damage; Contact Resistance: 30 m Max | 852, 96 hours | |
| Cold Resistance | Appearance: No damage; Contact Resistance: 30 m Max | -253, 96 hours | |
| Humidity Resistance | Appearance: No damage; Contact Resistance: 30 m Max; Withstand Voltage: No Breakdown/Flashover; Insulation Resistance: 100M Min | 602, 90-95% RH, 96 hours | |
| Temperature Cycling | Appearance: No damage; Contact Resistance: 30 m Max | 5 cycles (-25 for 30 min to +85 for 30 min) | |
| Salt Spray | Appearance: No damage; Contact Resistance: 30 m Max | 51% salt solution at 352 for 241 hours | |
| Solderability | Solder Wetting: 95% immersion area | Soldering Time: 3-5 sec; Temperature: 2455 | |
| Solder Resistance | Appearance: No damage | SMT reflow: 5-10 sec; Temperature: 2555 (Refer to 9.1 curve) | |
| Insertion & Withdrawal Force (Refer to Section 8) | |||
| SMT Lead-free Process Temperature Curve (Refer to Section 9) | |||
| Insertion/Withdrawal Force Table | 2 Pins | Initial: 0.4 N Max (I.F), 0.3 N Min (W.F) 30th Cycle: 12 N Max (I.F), 2.4 N Min (W.F) | (I.F = Insertion Force, W.F = Withdrawal Force) |
| 3 Pins | Initial: 0.6 N Max (I.F), 0.5 N Min (W.F) 30th Cycle: 13 N Max (I.F), 2.6 N Min (W.F) | ||
| 4 Pins | Initial: 0.8 N Max (I.F), 0.6 N Min (W.F) 30th Cycle: 14 N Max (I.F), 2.8 N Min (W.F) | ||
| ... (Data continues for up to 20 Pins) ... | |||
| SMT Process Notes | Check reflow soldering conditions with own equipment due to variations in devices, P.C. boards, etc. | ||
| Caution | Avoid exposure to temperatures >30 and humidity >60%RH after opening package. Use within 24 hours to prevent foaming/deformation during reflow/wave soldering due to moisture absorption. |
2507241130_kinghelm-KH-A12501-02Y_C49424489.pdf