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Compact electrical connector kinghelm KH-A12501-10Y 1.25 ultra thin series for space constrained applications

Manufacturer:
kinghelm
Description:
1.25mm 1 -25℃~+85℃ 10 Non-Latching P=1.25mm Rectangular Connector Housings RoHS
Category:
Arrays, Edge Type, Mezzanine (Board to Board)/Rectangular Connector Housings
Specifications
Pitch:
1.25mm
Flame Retardant Rating:
UL94V-0
Colour:
白色
Number Of Rows:
1
With Wings:
不带翅
Operating Temperature:
-25℃~+85℃
Number Of PINs Per Row:
10
Plastic Material:
PBT
Number Of Positions Or Pins:
1x10P
With Locker:
不带锁扣
Mfr. Part #:
KH-A12501-10Y
Package:
P=1.25mm
Model Number:
KH-A12501-10Y
Introduction

Product Overview

The 1.25 Ultra-Thin Series Connector is designed for reliable electrical connections in various applications. This series offers a compact and ultra-thin profile, making it suitable for space-constrained environments. Key features include robust electrical performance, mechanical durability, and adherence to environmental protection standards. The connectors are engineered for consistent performance across a range of operating temperatures and are built with high-quality materials for longevity and dependability.

Product Attributes

  • Product Series: 1.25 Ultra-Thin Series
  • Brand: Kinghelm ()
  • Model/Item No.: KH-A12501-10Y
  • Environmental Protection Grade: RoHS 2.0
  • Housing Material: PBT (UL94V-0)
  • Housing Color: White
  • Wafer Material: PA9T (UL94V-0)
  • Wafer Color: Beige

Technical Specifications

Specification Details
Scope 1.25 Ultra-Thin Series Connector Specification
Appearance Product surface without defects, dirt, cracks, or mechanical damage. Contacts without rust, plating not oxidized or peeled.
Dimensions According to drawings
Material & Surface Treatment
  • Terminal: Phosphor Bronze (0.15mm thick), Tin Plating (2.5-5m)
  • Housing: PBT (UL94V-0), White
  • Wafer: PA9T (UL94V-0), Beige
  • Contact: Phosphor Bronze (0.30mm thick), Gold Plating (0.5-1m)
  • Solder Tab: Phosphor Bronze (0.20mm thick), Tin Plating (2.5-5m)
Ratings
  • Rated Voltage: 125V AC/DC
  • Rated Current: 1A AC/DC
  • Ambient Temperature Range: -25 to +85
  • Applicable Wire Gauge: AWG28#-32#
Electrical Performance
  • Contact Resistance: Initial: 20m Max, After Test: 30m Max
  • Withstand Voltage: 500V AC for 1 minute (No Breakdown/Flashover)
  • Insulation Resistance: 100M Min (at 500V DC)
Mechanical Performance
  • Terminal Crimping Wire Strength: AWG#28: 13N, AWG#30: 8N, AWG#32: 6N
  • Terminal/Housing Retention Force: 8N Min (per contact)
  • Insertion & Withdrawal Force: Refer to Section 8
  • Pin Retention Force: 2N Min (per contact)
Endurance Characteristics
  • Repeated Insertion/Withdrawal: 30 cycles (Contact Resistance: 30m Max)
  • Temperature Rise: 30 Max (at rated current)
  • Vibration Test: Amplitude 1.5mm P-P, 10-55-10Hz, 2 hrs/axis (Contact Resistance: 30m Max, Discontinuity: 1 micro-second Max)
  • Heat Resistance: 852, 96 hours (Contact Resistance: 30m Max)
  • Cold Resistance: -253, 96 hours (Contact Resistance: 30m Max)
  • Humidity: 602, 90-95% RH, 96 hours (Contact Resistance: 30m Max, Withstand Voltage: No Breakdown/Flashover, Insulation Resistance: 100M Min)
  • Temperature Cycling: 5 cycles (-25 30min to +85 30min) (Contact Resistance: 30m Max)
  • Salt Spray: 352, 51% solution, 241 hours (Contact Resistance: 30m Max)
  • Solderability: Solder Temp: 2455, Time: 3-5 sec (Solder Wetting: >95% immersion area)
  • Solder Resistance: SMT Reflow Temp: 2555, Time: 5-10 sec (Refer to Section 9.1 for curve)
Insertion/Withdrawal Force (Section 8)
No. of CTK PIN Initial I.F (N Max) Initial W.F (N Min) At 30th I.F (N Max) At 30th W.F (N Min)
24.50.42.41.8
36.50.62.62.0
490.82.82.1
5111.03.02.3
6131.23.22.4
715.51.43.42.6
817.51.63.62.7
9201.83.82.9
10222.04.03.0
11242.2--
1226.52.4--
1328.52.6--
14312.8--
15333.0--
16353.2--
17373.4--
18393.6--
19413.8--
20444.0--
SMT Lead-Free Process Temperature Curve (Section 9) Refer to the provided temperature curve. Note: Reflow soldering conditions may vary based on devices, P.C. boards, etc. Pre-check with own equipment is recommended.
Caution (Section 10) Plastic material is hygroscopic. After opening the package, avoid exposure to environments with temperatures >30 and humidity >60%RH. Use all components within 24 hours after opening to prevent foaming and deformation during reflow or wave soldering processes.

2507241130_kinghelm-KH-A12501-10Y_C49424497.pdf

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